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TCP-3039NQT

Onsemi

TCP-3039NQT by Onsemi

TCP-3039NQT by Onsemi is a surface mount telecom IC with 6 terminals in a chip carrier package. It operates b/w -30 °C to 85°C, with a compact size of 1.2mm width and 1.6mm length. Ideal for telecom circuit applications due to its very thin profile and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 676 parts In-Stock

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Digiode

USA . 127 parts In-Stock

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TANS Electronics

Latvia . 8,168 parts In-Stock

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SupplyDigital Components

Austria . 8,010 parts In-Stock

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Kulean Microsystems

USA . 6,815 parts In-Stock

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Problanco Electronics

Mexico . 4,915 parts In-Stock

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Corphita

USA . 981 parts In-Stock

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UHIMA Technologies

Türkiye . 893 parts In-Stock

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Corohmni

South Africa . 98 parts In-Stock

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Overview

Looking to enhance your telecom interface systems? Look no further than the TCP-3039NQT by Onsemi. With a reputation for top-quality products, Onsemi delivers reliability and performance you can trust. This chip carrier is perfect for various applications in the telecom industry, offering seamless integration and efficiency. Upgrade your systems with the TCP-3039NQT today and experience the superior value and benefits it brings to your projects.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and provides a stable structure for the IC, making it easier to handle and integrate into circuit designs.

No. of Terminals: 6

The 6 terminals provide multiple connections for various functions, offering versatility in telecom applications.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile of the chip carrier package style helps in reducing overall product size, crucial for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions, ensuring reliable performance in diverse scenarios.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature range allows the IC to function effectively even in cold environments, enhancing its reliability.

Terminal Position: QUAD

Quad terminal position offers a balanced distribution of connections, facilitating efficient signal routing and connection management.

Maximum Seated Height: 1 mm

The low seated height enables compact stacking of components on the PCB, contributing to space-saving designs.

Width: 1.2 mm

The narrow width of the IC makes it suitable for applications where space is limited, allowing for more compact and efficient circuit layouts.

Length: 1.6 mm

The small length of the IC aids in creating compact designs, especially in applications where size constraints are critical.

Terminal Form: NO LEAD

No-lead terminal form reduces the risk of solder joints cracking and enhances the overall reliability and durability of the IC in telecom applications.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC is optimized to deliver high performance, accuracy, and efficiency in telecom circuit designs.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for dense packing of terminals on the IC, enabling high connectivity in a limited space environment.

Technical Specifications

Other Function Telecom Interface ICs TCP-3039NQT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-XQCC-N6

Length:

1.6 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

1.2 mm

Trade Compliance

TCP-3039NQT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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