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TCP-3033N-DT

Onsemi

TCP-3033N-DT by Onsemi

TCP-3033N-DT by Onsemi is a telecom IC with 10 terminals in a grid array package. It operates b/w -30 °C to 85°C, with a very thin profile of 0.611mm height and 0.722mm width. Ideal for telecom circuit applications requiring fine pitch and surface mount compatibility.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,755 parts In-Stock

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1,755

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Digiode

USA . 1,281 parts In-Stock

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1,281

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Problanco Electronics

Mexico . 8,028 parts In-Stock

1+ parts

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8,028

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Kulean Microsystems

USA . 5,679 parts In-Stock

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5,679

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TANS Electronics

Latvia . 3,947 parts In-Stock

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3,947

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SupplyDigital Components

Austria . 3,256 parts In-Stock

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3,256

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Corphita

USA . 1,539 parts In-Stock

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1,539

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UHIMA Technologies

Türkiye . 800 parts In-Stock

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800

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Corohmni

South Africa . 377 parts In-Stock

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377

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Overview

Enhance your telecommunications systems with the TCP-3033N-DT by Onsemi, a cutting-edge telecom interface IC designed to elevate your communication capabilities. Crafted with precision and expertise by Onsemi, a renowned leader in semiconductor manufacturing, this product offers unparalleled quality and reliability. From grid arrays to fine pitch packages, this versatile IC is ideal for a wide range of applications. Experience seamless connectivity, improved performance, and enhanced efficiency with the TCP-3033N-DT. Elevate your telecommunications experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on circuit boards.

No. of Terminals: 10

10 terminals provide sufficient connectivity options for various telecom applications.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with a thin profile and fine pitch enhances signal integrity and reduces signal interference.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in a wide range of environments.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and improves connectivity.

Maximum Seated Height: 0.611 mm

Low maximum seated height minimizes space requirements and allows for compact designs.

Width: 0.722 mm

Narrow width enables high-density packing of components on the circuit board.

Length: 1.029 mm

Compact length facilitates space-saving integration into electronic devices.

Terminal Form: BALL

Ball terminal form ensures secure and reliable connections for telecom applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring optimal performance and compatibility in telecommunication systems.

Technical Specifications

Other Function Telecom Interface ICs TCP-3033N-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B10

Length:

1.029 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.611 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

.722 mm

Trade Compliance

TCP-3033N-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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