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TCP-3047H-DT

Onsemi

TCP-3047H-DT by Onsemi

TCP-3047H-DT by Onsemi is a telecom IC with 12 terminals in a grid array package. It operates b/w -30 °C to 85°C, with a very thin profile of 0.611mm height and 0.722mm width. Ideal for telecom circuits, it's surface-mountable and features ball terminals for various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,431 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,368 parts In-Stock

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Bristol Electronics

USA . 1,368 parts In-Stock

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Dan-Mar Components

USA . 1,368 parts In-Stock

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Vyrian

USA . 502 parts In-Stock

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Distributors (Availability)

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Kulean Microsystems

USA . 5,091 parts In-Stock

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TANS Electronics

Latvia . 4,635 parts In-Stock

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Problanco Electronics

Mexico . 1,944 parts In-Stock

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SupplyDigital Components

Austria . 1,640 parts In-Stock

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UHIMA Technologies

Türkiye . 669 parts In-Stock

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669

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Corphita

USA . 388 parts In-Stock

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Corohmni

South Africa . 91 parts In-Stock

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Overview

Enhance your telecom interface systems with the TCP-3047H-DT by Onsemi, a top-quality product designed to optimize performance and reliability. Onsemi is a trusted manufacturer known for delivering cutting-edge solutions in the telecom industry. This versatile IC offers seamless integration, advanced functionality, and exceptional durability, making it ideal for a wide range of applications. Elevate your projects with the TCP-3047H-DT and experience the value and benefits it brings to your telecommunications systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Package Shape: RECTANGULAR

Rectangular shape offers efficient use of space and easy integration into electronic systems.

No. of Terminals: 12

Having 12 terminals allows for versatile connectivity options and functionality.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array, thin profile, and fine pitch package style ensures a compact design and high performance.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows for operation in colder environments.

Terminal Position: BOTTOM

Bottom terminal position simplifies the connection process and enhances space efficiency.

Maximum Seated Height: 0.611 mm

Low maximum seated height contributes to a low-profile design for space-constrained applications.

Width: 0.722 mm

Narrow width facilitates easy integration and placement within electronic systems.

Length: 1.179 mm

Compact length offers a space-saving solution for compact electronic designs.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections for enhanced performance.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuit applications, ensuring optimized performance in telecommunication systems.

Technical Specifications

Other Function Telecom Interface ICs TCP-3047H-DT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PBGA-B12

Length:

1.179 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.611 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

BOTTOM

Width:

.722 mm

Trade Compliance

TCP-3047H-DT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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