Loading...

PRH601HL/C1,557

NXP Semiconductors

PRH601HL/C1,557 by NXP Semiconductors

PRH601HL/C1,557 by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates at 3.3V and 5V with a max temp of 70 °C, featuring a compact flatpack design with 100 terminals. Ideal for communication systems requiring reliable performance in varying conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,858 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,858

-

-

-

-

Digiode

USA . 3,148 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,148

-

-

-

-

Anansix

USA . 2,113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,113

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 203 parts In-Stock

1+ parts

$20.270

100+ parts

-

1k+ parts

-

10k+ parts

-

203

$20.270

-

-

-

One Stop Electronics

USA . 775 parts In-Stock

1+ parts

$432.000

100+ parts

-

1k+ parts

-

10k+ parts

-

775

$432.000

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 11,129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,129

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

UNI Independent Distributors

Spain . 3,848 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,848

-

-

-

-

Corphita

USA . 1,779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,779

-

-

-

-

Overview

Unlock seamless connectivity and superior performance with the PRH601HL/C1,557 from NXP Semiconductors. Renowned for innovation, NXP ensures this Telecom Interface IC excels in reliability and efficiency, perfect for various applications. Enjoy enhanced data transmission with robust temperature resilience and a compact design, making it ideal for both consumer and industrial electronics. Trust in NXP's quality to elevate your projects and drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it ideal for telecom applications.

Surface Mount: YES

Being surface mount allows for compact design and easy integration into a variety of circuit boards, improving space efficiency.

Package Shape: SQUARE

The square package shape simplifies PCB layout and optimizes space usage, promoting design flexibility.

Power Supplies (V): 3.3, 5

Compatible with both 3.3V and 5V power supplies, this IC caters to a wide range of applications and ensures versatility.

No. of Terminals: 100

With 100 terminals, this IC offers extensive connectivity options, facilitating complex circuit designs and functionality.

Package Style (Meter): FLATPACK

The flatpack style contributes to low-profile design and enhanced thermal performance, making it suitable for dense layouts.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in moderately high-temperature environments.

Minimum Operating Temperature: -25 °C

With a minimum operating temperature of -25 °C, this IC is capable of functioning in cold climates, enhancing its application range.

Terminal Position: QUAD

Quad terminal positioning provides efficient routing options and aids in minimizing the PCB footprint.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C supports compatibility with various soldering processes, ensuring robust assembly.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and provides good mechanical stability, ensuring reliability in connections.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density packaging, making it suitable for modern compact electronic designs.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates moderate sensitivity to moisture, guiding storage and handling practices for increased reliability.

Technical Specifications

Other Function Telecom Interface ICs PRH601HL/C1,557 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G100

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

100

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

PRH601HL/C1,557 Telecommunications trade compliance attributes, and parameters.

HTS

8543.70

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 1