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SST12LF02-QXCE

Microchip Technology

SST12LF02-QXCE by Microchip Technology

SST12LF02-QXCE by Microchip: Telecom IC with 16 terminals, 3.3V supply voltage, -20 to 85°C operating temp. Ideal for telecom circuits, surface mountable in a square chip carrier package with 0.5mm terminal pitch.

Median Price

$1.241

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.683

100+ parts

-

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100

$0.683

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Bristol Electronics

USA . 2,647 parts In-Stock

1+ parts

$1.800

100+ parts

$1.116

1k+ parts

$0.594

10k+ parts

-

2,647

$1.800

$1.116

$0.594

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Vyrian

USA . 5,454 parts In-Stock

1+ parts

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5,454

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ACDS - Activité Composants Distribution Service

France . 2,647 parts In-Stock

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2,647

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Dan-Mar Components

USA . 2,647 parts In-Stock

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2,647

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 3,435 parts In-Stock

1+ parts

$0.683

100+ parts

-

1k+ parts

-

10k+ parts

$0.662

3,435

$0.683

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-

$0.662

Continental Prestige Electronics

USA . 1,525 parts In-Stock

1+ parts

$0.683

100+ parts

-

1k+ parts

-

10k+ parts

$0.669

1,525

$0.683

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-

$0.669

Corohmni

South Africa . 316 parts In-Stock

1+ parts

$0.683

100+ parts

-

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316

$0.683

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AZTECH Wire

Italy . 619 parts In-Stock

1+ parts

$5.156

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619

$5.156

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Aztec Data Supply Inc.

USA . 2,389 parts In-Stock

1+ parts

$9.580

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2,389

$9.580

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Semicontronic

India . 782 parts In-Stock

1+ parts

$61.000

100+ parts

$59.475

1k+ parts

$59.170

10k+ parts

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782

$61.000

$59.475

$59.170

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Ampacity Inc.

Singapore . 809 parts In-Stock

1+ parts

$124.000

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809

$124.000

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QUARKTWIN TECHNOLOGY LTD

USA . 29,963 parts In-Stock

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Perfect Parts

USA . 6,322 parts In-Stock

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6,322

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Marpe Global Electronics

Taiwan . 1,497 parts In-Stock

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1,497

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.669

1k+ parts

$0.648

10k+ parts

$0.635

1,000

-

$0.669

$0.648

$0.635

QualityLine Systems

Poland . 976 parts In-Stock

1+ parts

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976

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XL Components Corporation

Australia . 76 parts In-Stock

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76

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Overview

Elevate your telecom projects with the SST12LF02-QXCE by Microchip Technology. Crafted with precision and reliability in mind, this cutting-edge IC offers unmatched performance and versatility for all your telecom interface needs. With a compact square package shape and very thin profile, this product is designed to seamlessly integrate into any design. Experience the superior quality and seamless connectivity that Microchip Technology is known for, while enjoying the added value and efficiency that the SST12LF02-QXCE brings to your projects. Upgrade your telecom systems today with this innovative solution.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto printed circuit boards, saving time and effort in the manufacturing process.

Package Shape: SQUARE

The square package shape contributes to a compact design, making it easier to fit this product into tight spaces within electronic devices.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for various features and functions, enhancing the versatility of the product.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles allows for efficient heat dissipation and space-saving characteristics in the design.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product can withstand elevated temperatures, ensuring reliable performance in different environmental conditions.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature of -20°C ensures that the product can function effectively even in cold environments without any performance issues.

Terminal Finish: MATTE TIN

The matte tin terminal finish offers good solderability, corrosion resistance, and electrical conductivity, ensuring a reliable connection for the product's terminals.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, enhancing the overall durability and reliability of the product during operation.

Maximum Seated Height: 0.5 mm

The maximum seated height of 0.5mm allows for a low-profile design, making it suitable for applications where space constraints are a concern.

Width: 3 mm

The compact width of 3mm enables easy integration into various electronic devices without occupying excessive space.

Length: 3 mm

The small length of 3mm further contributes to the overall compactness of the product, making it ideal for applications with limited space availability.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the manufacturing process, as it eliminates the need for lead-based soldering techniques, making it environmentally friendly.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit type, this product is specifically designed for telecommunications applications, ensuring optimized performance and compatibility in such scenarios.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures compatibility with standard power sources, making it easy to integrate this product into existing electronic systems.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density mounting, maximizing connectivity options and functionality in the product.

Technical Specifications

Other Function Telecom Interface ICs SST12LF02-QXCE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

SST12LF02-QXCE Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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