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AMIS49587C5872G

Onsemi

AMIS49587C5872G by Onsemi

AMIS49587C5872G by Onsemi is a 52-terminal telecom IC with 3.3V supply, operating from -40 to 80 °C. It features a square chip carrier package style and 0.5mm terminal pitch, suitable for telecom circuit applications requiring low power consumption at a max current of 0.08mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,874 parts In-Stock

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12,874

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Digiode

USA . 1,996 parts In-Stock

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1,996

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Distributors (Availability)

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Native Components

USA . 745 parts In-Stock

1+ parts

$0.451

100+ parts

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$0.432

745

$0.451

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$0.432

Northwest PG Solutions

USA . 1,829 parts In-Stock

1+ parts

$0.496

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-

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$0.437

1,829

$0.496

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$0.437

Corohmni

South Africa . 226 parts In-Stock

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$6.105

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226

$6.105

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Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$17.902

100+ parts

$16.291

1k+ parts

$14.680

10k+ parts

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870

$17.902

$16.291

$14.680

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AZTECH Wire

Italy . 546 parts In-Stock

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$18.880

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546

$18.880

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Kulean Microsystems

USA . 8,358 parts In-Stock

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8,358

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TANS Electronics

Latvia . 8,292 parts In-Stock

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SupplyDigital Components

Austria . 7,721 parts In-Stock

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Kepictronics

USA . 4,460 parts In-Stock

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4,460

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Corphita

USA . 768 parts In-Stock

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768

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UHIMA Technologies

Türkiye . 743 parts In-Stock

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743

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Microchip USA

USA . 375 parts In-Stock

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Problanco Electronics

Mexico . 351 parts In-Stock

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Overview

Discover the AMIS49587C5872G by Onsemi, a high-quality telecom interface IC that offers unmatched performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this chip carrier with heat sink/slug and very thin profile is suitable for various applications. With a nominal supply voltage of 3.3V and a maximum supply current of 0.08mA, this innovative product ensures efficient power management. Experience seamless connectivity and enhanced functionality with the AMIS49587C5872G, the perfect solution for your telecom interface needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount compatibility allows for easy installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape can provide better heat dissipation and easier mounting on the PCB compared to irregular shapes.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, making it compatible with most existing systems and components.

No. of Terminals: 52

With a high number of terminals, this IC can support complex telecom interfaces and functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile packaging style allows for efficient heat dissipation and space-saving on the PCB.

Maximum Operating Temperature: 80 °C

Can operate effectively in high-temperature environments, providing reliability under various conditions.

Minimum Operating Temperature: -40 °C

Suitable for use in cold environments without compromising performance or reliability.

Terminal Position: QUAD

Quad terminal positioning allows for better connectivity and signal transmission, enhancing the overall performance of the IC.

Maximum Seated Height: 1 mm

Low profile design with a maximum seated height of 1mm enables compact and space-saving PCB layouts.

Width: 8 mm

Compact width of 8mm makes it suitable for applications where space is limited.

Length: 8 mm

Square shape with a length of 8mm further contributes to space-saving and efficient PCB layout.

Terminal Form: NO LEAD

No lead terminals simplify the assembly process and reduce the risk of soldering errors.

Maximum Supply Current: 0.08 mA

Low maximum supply current of 0.08 mA helps in reducing power consumption and heat generation.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance and compatibility in telecommunications systems.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3V, the IC maintains stable operation and compatibility with standard power supplies.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and efficient signal routing on the PCB.

Technical Specifications

Other Function Telecom Interface ICs AMIS49587C5872G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-XQCC-N52

Length:

8 mm

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC52,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Modems

Maximum Supply Current:

.08 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Trade Compliance

AMIS49587C5872G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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