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AMIS-52100-M

Onsemi

AMIS-52100-M by Onsemi

AMIS-52100-M by Onsemi is a telecom interface IC with 20 terminals, operating at 0-50 °C. It has a supply voltage of 3V and current of 25mA, suitable for commercial applications requiring small outline surface mount packages.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,036 parts In-Stock

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Vyrian

USA . 2,028 parts In-Stock

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Prism Electronics

USA . 96 parts In-Stock

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Native Components

USA . 876 parts In-Stock

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$1.453

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Northwest PG Solutions

USA . 1,038 parts In-Stock

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$1.598

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Problanco Electronics

Mexico . 7,918 parts In-Stock

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Kulean Microsystems

USA . 6,353 parts In-Stock

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TANS Electronics

Latvia . 4,201 parts In-Stock

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SupplyDigital Components

Austria . 3,221 parts In-Stock

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Corphita

USA . 2,092 parts In-Stock

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Corohmni

South Africa . 120 parts In-Stock

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UHIMA Technologies

Türkiye . 72 parts In-Stock

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Overview

Unlock seamless connectivity with the AMIS-52100-M by Onsemi - a cutting-edge product in the realm of Other Function Telecom Interface ICs. Crafted with precision and expertise, this marvel boasts unparalleled quality and reliability, courtesy of its esteemed manufacturer. Perfect for a myriad of applications, this product offers unmatched value to customers seeking seamless integration and superior performance. Elevate your projects with the AMIS-52100-M and experience the endless benefits it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the product in various operating conditions, making it a reliable choice for long-term use.

Surface Mount: YES

Allows for easy and efficient installation in electronic devices, saving time and effort during assembly.

Power Supplies (V): 3

Operates at a standard voltage level, ensuring compatibility with a wide range of applications.

No. of Terminals: 20

Provides multiple connection points for interfacing with other components, allowing for versatile functionality.

Maximum Operating Temperature: 50 °C

Can withstand high temperatures without performance degradation, suitable for demanding environments.

Minimum Operating Temperature: 0 °C

Operates effectively in low-temperature conditions, making it suitable for use in a variety of settings.

Terminal Position: DUAL

Offers flexibility in circuit design and connectivity options, enhancing the product's versatility.

Maximum Supply Current: 25 mA

Operates within a low current range, ensuring energy efficiency and minimizing power consumption.

Nominal Supply Voltage: 3 V

Maintains a stable voltage supply for proper functioning and performance consistency.

Terminal Pitch: 0.635 mm

Provides precise spacing for terminals, facilitating accurate connections and reliable signal transmission.

Technical Specifications

Other Function Telecom Interface ICs AMIS-52100-M attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

No. of Terminals:

20

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

25 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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