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AMIS-49250-XTD

Onsemi

AMIS-49250-XTD by Onsemi

AMIS-49250-XTD by Onsemi is a telecom interface IC with 44 terminals, operating at -40 to 85 °C. It has a supply voltage of 3.5V, data rate of 0.03125 Mbps, and terminal pitch of 0.5mm. Ideal for industrial applications requiring low power consumption and compact design in a square chip carrier package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 9,848 parts In-Stock

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Digiode

USA . 954 parts In-Stock

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Native Components

USA . 326 parts In-Stock

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$0.780

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326

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Northwest PG Solutions

USA . 234 parts In-Stock

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$0.858

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AZTECH Wire

Italy . 871 parts In-Stock

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$9.730

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TANS Electronics

Latvia . 7,743 parts In-Stock

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SupplyDigital Components

Austria . 4,531 parts In-Stock

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Kulean Microsystems

USA . 3,024 parts In-Stock

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Problanco Electronics

Mexico . 1,495 parts In-Stock

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Corphita

USA . 481 parts In-Stock

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Microchip USA

USA . 424 parts In-Stock

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Corohmni

South Africa . 401 parts In-Stock

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UHIMA Technologies

Türkiye . 281 parts In-Stock

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Overview

Unlock the potential of your telecom systems with the AMIS-49250-XTD by Onsemi. This high-quality telecom interface IC offers unparalleled performance and reliability, thanks to Onsemi's reputation as a leading manufacturer in the industry. Ideal for a wide range of applications, this product delivers exceptional value by providing seamless connectivity and efficient data transfer. Upgrade your telecom systems with the AMIS-49250-XTD and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, making this product suitable for high volume production and compact designs.

Package Shape: SQUARE

The square package shape helps in maximizing board space utilization and simplifies the layout of the overall design.

Power Supplies (V): 3.5

The 3.5V power supply allows for compatibility with a wide range of standard power sources, making integration into existing systems seamless.

No. of Terminals: 44

With 44 terminals, this product offers a high level of connectivity options, enabling complex telecom interface functionalities.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides robust protection to the integrated circuits, ensuring reliability in various operating conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows for reliable performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures functionality even in extremely cold conditions.

Technical Specifications

Other Function Telecom Interface ICs AMIS-49250-XTD attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

Data Rate:

.03125 Mbps

JESD-30 Code:

S-XQCC-N44

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC44,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3,5

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.0008 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

AMIS-49250-XTD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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