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AMIS-52100-A

Onsemi

AMIS-52100-A by Onsemi

AMIS-52100-A by Onsemi is a 20-terminal IC with 3V supply voltage and 25mA max current. It operates b/w 0-50 °C, suitable for telecom interfaces. The small outline package is surface-mountable, making it ideal for commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,208 parts In-Stock

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Vyrian

USA . 160 parts In-Stock

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160

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Distributors (Availability)

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Native Components

USA . 19 parts In-Stock

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$0.445

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$0.427

19

$0.445

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$0.427

Northwest PG Solutions

USA . 453 parts In-Stock

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$0.489

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$0.432

453

$0.489

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$0.432

Problanco Electronics

Mexico . 8,382 parts In-Stock

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SupplyDigital Components

Austria . 4,847 parts In-Stock

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TANS Electronics

Latvia . 2,817 parts In-Stock

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Kulean Microsystems

USA . 2,162 parts In-Stock

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Corphita

USA . 514 parts In-Stock

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UHIMA Technologies

Türkiye . 277 parts In-Stock

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Corohmni

South Africa . 239 parts In-Stock

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Overview

Discover the cutting-edge technology of the AMIS-52100-A by Onsemi, a dynamic solution in the category of Other Function Telecom Interface ICs. With superior manufacturing quality and innovative design, this product offers unmatched performance and reliability. Ideal for various applications, this IC provides value and benefits to customers looking for seamless integration and optimal functionality. Experience the advantages of the AMIS-52100-A and elevate your projects to new heights with Onsemi's trusted expertise and commitment to excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made from plastic/epoxy, this product is lightweight and durable.

Surface Mount: YES

The surface mount feature makes it easy to install and saves valuable space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and alignment on the PCB.

Power Supplies (V): 3

Operating at a standard voltage of 3V, this product is compatible with many systems.

No. of Terminals: 20

With 20 terminals, this product offers ample connectivity options for various functions.

Maximum Operating Temperature: 50 °C

Capable of operating at high temperatures, this product is suitable for demanding environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures reliability in diverse conditions.

Terminal Position: DUAL

Dual terminal positions provide flexibility in installation and connectivity.

Temperature Grade: COMMERCIAL

Designed for commercial use, this product meets industry standards for reliability and performance.

Terminal Form: GULL WING

The gull wing terminal form is suitable for surface mount applications, enhancing ease of installation.

Maximum Supply Current: 25 mA

With a maximum supply current of 25mA, this product consumes low power, making it energy efficient.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V, this product is compatible with standard power sources.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm allows for high-density mounting on the PCB, optimizing space usage.

Technical Specifications

Other Function Telecom Interface ICs AMIS-52100-A attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

No. of Terminals:

20

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

25 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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