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AMIS-52150-XTP

Onsemi

AMIS-52150-XTP by Onsemi

AMIS-52150-XTP by Onsemi is a telecom IC with 20 terminals, operating at 3V. It has a small outline package style, Gull Wing terminal form, and operates b/w 0 to 50 °C. Ideal for telecom interface applications due to its low supply current of 0.025mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,923 parts In-Stock

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Vyrian

USA . 148 parts In-Stock

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Problanco Electronics

Mexico . 3,840 parts In-Stock

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TANS Electronics

Latvia . 2,804 parts In-Stock

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Kulean Microsystems

USA . 2,491 parts In-Stock

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SupplyDigital Components

Austria . 1,625 parts In-Stock

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Native Components

USA . 863 parts In-Stock

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Northwest PG Solutions

USA . 832 parts In-Stock

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UHIMA Technologies

Türkiye . 523 parts In-Stock

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Corohmni

South Africa . 213 parts In-Stock

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Corphita

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Overview

Discover the unparalleled quality and reliability of the AMIS-52150-XTP by Onsemi, a leading manufacturer in the industry. This innovative product falls under the category of Other Function Telecom Interface ICs, offering countless applications and benefits to customers. With its advanced technology and superior design, this telecom circuit provides exceptional performance and efficiency, making it an essential component for a wide range of electronic devices. Trust Onsemi for cutting-edge solutions that deliver value and excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular package shape provides compatibility with standard PCB layouts and allows for easy integration into existing designs.

Power Supplies (V): 3

Operating at 3V ensures compatibility with common power sources, making it easy to integrate into different systems.

No. of Terminals: 20

Having 20 terminals provides flexibility in connectivity options and allows for a wide range of input and output connections.

Package Style: SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style helps in conserving board space, making it suitable for compact electronic devices.

Maximum Operating Temperature: 50 °C

With a high maximum operating temperature of 50 °C, this product can withstand heat in demanding environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures down to 0 °C ensures reliable performance in various operating conditions.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved reliability in connection, ensuring uninterrupted functionality.

Maximum Seated Height: 2 mm

A low maximum seated height of 2mm enables a compact design and facilitates installation in space-constrained applications.

Width: 5.3 mm

The narrow width of 5.3mm contributes to the overall compactness of the product, making it suitable for small electronic devices.

Length: 7.2 mm

The short length of 7.2mm further enhances the product's compact form factor, allowing for easy integration into limited space designs.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable performance in standard operating conditions, making it suitable for commercial applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure solder joints and ease of soldering, enhancing the overall reliability of the connections.

Maximum Supply Current: 0.025 mA

Operating at a low maximum supply current of 0.025mA helps in conserving power and ensures energy-efficient operation.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers reliable performance and compatibility with telecommunications systems.

Nominal Supply Voltage: 3 V

With a nominal supply voltage of 3V, this product can easily interface with standard power sources, ensuring seamless integration.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting on PCBs, making it suitable for space-constrained designs.

Technical Specifications

Other Function Telecom Interface ICs AMIS-52150-XTP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.025 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

AMIS-52150-XTP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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