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AMIS-53000-I

Onsemi

AMIS-53000-I by Onsemi

AMIS-53000-I by Onsemi is a CMOS telecom interface IC with 32 terminals in a square flatpack package. It operates b/w -40 to 85 °C, with power supplies of 2.2/3.3V and max supply current of 70mA. Ideal for industrial applications requiring surface mount technology.

Median Price

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Lifecycle Status

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Digiode

USA . 1,502 parts In-Stock

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Vyrian

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Kulean Microsystems

USA . 7,313 parts In-Stock

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SupplyDigital Components

Austria . 3,860 parts In-Stock

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TANS Electronics

Latvia . 1,395 parts In-Stock

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Corphita

USA . 1,126 parts In-Stock

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Native Components

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Northwest PG Solutions

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UHIMA Technologies

Türkiye . 284 parts In-Stock

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Corohmni

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Problanco Electronics

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Overview

Enhance your telecom interface applications with the AMIS-53000-I by Onsemi. With a commitment to quality and innovation, Onsemi delivers cutting-edge solutions for a wide range of industries. The AMIS-53000-I offers unmatched reliability and performance, making it the ideal choice for your projects. From industrial automation to telecommunications, this versatile IC provides value, benefits, and advantages that will take your designs to the next level. Upgrade your systems today with Onsemi's AMIS-53000-I.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to environmental factors, making it suitable for a variety of industrial applications.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Efficient use of space on the circuit board and easy to handle during manufacturing and testing processes.

Power Supplies (V): 2.2/3.3

Compatible with common voltage requirements in telecom systems, ensuring seamless integration with existing setups.

No. of Terminals: 32

Provides ample connectivity options for multiple functions and interfaces.

Package Style (Meter): FLATPACK

Compact design saves space on the circuit board and facilitates efficient routing of signals.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures common in industrial environments without compromising performance.

Minimum Operating Temperature: -40 °C

Capable of operating in cold conditions without any negative impact on functionality.

Terminal Position: QUAD

Allows for easy identification and connection of terminals, reducing the chance of errors during installation.

Temperature Grade: INDUSTRIAL

Designed to meet the rigorous demands of industrial applications, ensuring reliable performance in harsh environments.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation, enhancing overall efficiency.

Terminal Form: GULL WING

Enables easy soldering onto the circuit board, simplifying the assembly process.

Maximum Supply Current: 70 mA

Can handle moderate current loads, suitable for various telecom interface requirements.

Terminal Pitch: 0.8 mm

Provides precise spacing between terminals for reliable connections and signal integrity.

Technical Specifications

Other Function Telecom Interface ICs AMIS-53000-I attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G32

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.2/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

70 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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