Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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AMIS-52150-XTD by Onsemi is a telecom IC with 20 terminals, operating at 3V. It has a small outline package style, Gull Wing terminal form, and operates b/w 0 to 50 °C. Ideal for telecom interface applications due to its low supply current of 0.025mA and compact dimensions of 5.3mm x 7.2mm x 2mm.
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Having a plastic/epoxy body material makes the product more durable and resistant to damage, making it a reliable choice for telecom applications.
Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.
The rectangular package shape is commonly used and easily integrated into existing designs, making it versatile for different applications.
Operating at 3V provides a standard power supply requirement, making it compatible with various systems and reducing the need for additional components.
Having 20 terminals allows for multiple connections and functions, increasing the versatility and capabilities of the product.
The small outline and shrink pitch package style enables a compact design, ideal for space-constrained applications while maintaining high performance.
With a maximum operating temperature of 50 °C, the product can withstand high temperatures, ensuring reliable performance in various environments.
Operating at a minimum temperature of 0 °C ensures the product can function in cold environments without any issues, increasing its usability.
Dual terminal positions provide redundancy and flexibility in connectivity, ensuring reliable connections and ease of installation.
The maximum seated height of 2mm allows for a low-profile design, reducing the overall size of the product and enabling compact installations.
Having a width of 5.3mm makes the product compact and space-efficient, ideal for applications where size constraints are a concern.
The length of 7.2mm is compact, making the product suitable for small devices and applications where space is limited.
Being rated for commercial temperature grades ensures the product can operate reliably in typical commercial environments, making it suitable for a wide range of applications.
The gull wing terminal form allows for easy surface mounting and soldering, enhancing the product's durability and reliability.
With a maximum supply current of 0.025mA, the product is energy-efficient, reducing power consumption and operating costs.
Being a dedicated telecom circuit IC type ensures the product is specifically designed for telecom applications, offering optimized performance and reliability.
Operating at a nominal supply voltage of 3V ensures compatibility with standard power sources, making integration into existing systems easier.
With a terminal pitch of 0.65mm, the product allows for precise connections and miniaturization, making it suitable for high-density applications.
Other Function Telecom Interface ICs AMIS-52150-XTD attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Sub-Category:
Maximum Supply Current:
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Telecom IC Type:
Temperature Grade:
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AMIS-52150-XTD Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
BAV99
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
2N2222A
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
Renesas Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148WS
Synsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
National Semiconductor
SS14
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
261
New England Microwave
Other Interface ICs; No. of Terminals: 14; Package Equivalence Code: FL14(UNSPEC); Power Supplies (V): +-5,-15; Package Body Material: PLASTIC/EPOXY; Surface Mount: YES;
STM32H753BIT6
STMicroelectronics
STM32H753BIT6 by STMicroelectronics is a 32-bit microcontroller with 208 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and extensive peripherals for industrial applications like CAN, Ethernet, and USB connectivity. With a wide temperature range of -40 to +85 °C, it's ideal for demanding environments requiring high-speed processing capabilities.
Rochester Electronics
LL4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
LM555CMX
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
NEO-M8Q-0-10
U-blox Ag
NEO-M8Q-0-10 by U-blox Ag is a MICROELECTRONIC ASSEMBLY with 24 terminals, operating from -40 to 85 °C. Ideal for TELECOM CIRCUIT applications due to its INDUSTRIAL temperature grade and 3V supply voltage requirement.
AX-SFEU-1-01-TB05
AX-SFEU-1-01-TB05 by Onsemi is a Telecom Circuit IC with 40 terminals in a rectangular chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. This surface-mount IC is ideal for telecom interface applications requiring a very thin profile and industrial temperature grade.
CC1175RHBT
Texas Instruments
The Texas Instruments CC1175RHBT is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and data rate of 0.2 Mbps. This chip carrier package is suitable for industrial applications requiring a compact design and surface mount capability.
AP22811AW5-7
AP22811AW5-7 by Diodes Inc. is a telecom interface IC with 5 terminals, operating b/w -40 to 85°C. It features a small outline package style, matte tin finish, and nominal voltage of 5V. Ideal for telecom circuits, this IC has a low profile design and can withstand peak reflow temperatures up to 260°C.
SI4460-C2A-GMR
Silicon Labs
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
CY7B923-JXI
Infineon Technologies
CY7B923-JXI by Infineon is a BICMOS telecom IC with 400 Mbps data rate, operating at 5V. It features a square chip carrier package style, matte tin terminal finish, and quad terminal position. Ideal for industrial applications requiring high-speed telecommunications interfaces.
NINA-B112-03B-00
TELECOM CIRCUIT;
MCP2140-I/SO
MCP2140-I/SO by Microchip: Telecom IC with 18 terminals, CMOS tech, 3V supply voltage. Small outline package for telecom circuits, operates b/w -40 to 85°C. Ideal for industrial applications requiring TS 16949 screening level.
NRF51822-CFAC-R
Nordic Semiconductor Asa
NRF51822-CFAC-R by Nordic Semiconductor Asa is a telecom IC with 62 terminals in a square package. It operates b/w -25°C to 75°C, with a supply voltage of 1.8V. Ideal for applications requiring fine pitch and thin profile grid array packages.
XB3-24Z8UT
Digi International
The Digi International XB3-24Z8UT is an industrial-grade telecom circuit with 20 terminals in a through-hole package. It operates b/w -40°C to 85°C, making it suitable for various telecom interface applications. This MICROELECTRONIC ASSEMBLY offers reliable performance in harsh environments.
WL1801MODGBMOCT
WL1801MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a supply voltage of 3.7V and data rate of 100 Mbps. Ideal for telecom circuits, it has a compact rectangular shape and surface-mount capability.
ADRV9026BBCZ
Analog Devices
Analog Devices ADRV9026BBCZ is a telecom IC with 4 functions, operating at -40 to 110°C. It features a grid array package with 289 terminals and low profile design. Ideal for industrial applications requiring a nominal voltage of 1V and terminal pitch of 0.8mm.
HTSH5601ETK,118
NXP Semiconductors
NXP Semiconductors' HTSH5601ETK,118 is a telecom IC with 2 terminals in a small outline package. It operates b/w -25°C to 85°C and can withstand peak reflow temperature of 260°C for 30s. Ideal for telecom circuit applications due to its surface mount capability and dual terminal position.
NEO-M8T
NEO-M8T by U-blox Ag is a telecom IC with 24 terminals, operating temperature range of -40 to 85°C. It features AEC-Q100 screening and TS 16949 certification, suitable for industrial applications requiring a 3V supply voltage. The surface-mountable rectangular package makes it ideal for compact designs in various industries.
ESP32-PICO-D4
Espressif Systems (Shanghai)
ESP32-PICO-D4 by Espressif Systems is a telecom IC with 48 terminals in a square package. Operating from -40 to 85°C, it has a supply voltage of 3.3V. Ideal for industrial applications, this surface-mount IC is designed for telecom circuits with a terminal pitch of 0.5mm.
NEO-M8T-0-10
NEO-M8T-0-10 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and MSL level of 4, suitable for industrial applications requiring precise positioning and timing accuracy. With its compact rectangular package style, it's ideal for space-constrained environments.
XB3-24ACM-J
Digi International's XB3-24ACM-J is a TELECOM CIRCUIT with 1 Mbps Data Rate. Operating from -40 to 85 °C, it comes in RECTANGULAR package style. Ideal for telecom interfaces, this IC is designed for various applications requiring high-speed data transmission.
ZOE-M8Q
ISL32179EFRZ
Intersil
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
BLUENRG-248
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
AMIS-52150-XTP
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;
AMIS-52000
AMIS-49250-XTP
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 44; Package Code: HVQCCN; Package Shape: SQUARE;
AMIS-52150
Other Telecom ICs; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR;
AMIS-52100
AMIS49587C5872G
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 52; Package Code: HVQCCN; Package Shape: SQUARE;
AMIS-53000-I
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE;
AMIS-49200-XTD
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;
AMIS-52050
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SSOP; Package Shape: RECTANGULAR; Length: 7.2 mm;
AMIS49587C5871G
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
AMIS-52100-M
AMIS-52100-A
AMIS49587C5871RG
AMIS-49250-XTD
AMIS49587C5872RG
AMIS-49200
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
AMIS-49200-XTP
AMIS-49200-XTP by Onsemi is a telecom IC with 44 terminals in a square package. It operates at -40 to 85°C, with power supply of 3.5V and data rate of 0.03125 Mbps. Ideal for telecom interface applications due to its low supply current and industrial temperature grade suitability.
AMIS49587C5871R
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
AMIS-52100-I
Ami Semiconductor
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