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AMIS-52150-XTD

Onsemi

AMIS-52150-XTD by Onsemi

AMIS-52150-XTD by Onsemi is a telecom IC with 20 terminals, operating at 3V. It has a small outline package style, Gull Wing terminal form, and operates b/w 0 to 50 °C. Ideal for telecom interface applications due to its low supply current of 0.025mA and compact dimensions of 5.3mm x 7.2mm x 2mm.

Median Price

$6.990

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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TEDSS.com

USA . 66 parts In-Stock

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Digiode

USA . 1,291 parts In-Stock

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Vyrian

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Native Components

USA . 672 parts In-Stock

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$0.874

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Northwest PG Solutions

USA . 1,874 parts In-Stock

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$0.961

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Corohmni

South Africa . 257 parts In-Stock

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Problanco Electronics

Mexico . 8,161 parts In-Stock

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TANS Electronics

Latvia . 7,476 parts In-Stock

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Kulean Microsystems

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Corphita

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SupplyDigital Components

Austria . 1,406 parts In-Stock

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UHIMA Technologies

Türkiye . 234 parts In-Stock

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Overview

Elevate your telecom interface systems with the AMIS-52150-XTD by Onsemi. This top-notch telecom circuit IC boasts unmatched quality and reliability, backed by Onsemi's stellar reputation in the industry. Perfect for a wide range of applications, this small outline, shrink pitch package offers customers a seamless integration experience. With a nominal supply voltage of 3V and a low maximum supply current of 0.025mA, the AMIS-52150-XTD delivers exceptional performance while maintaining a compact design. Upgrade your telecom systems today with this cutting-edge solution from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Having a plastic/epoxy body material makes the product more durable and resistant to damage, making it a reliable choice for telecom applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easily integrated into existing designs, making it versatile for different applications.

Power Supplies (V): 3

Operating at 3V provides a standard power supply requirement, making it compatible with various systems and reducing the need for additional components.

No. of Terminals: 20

Having 20 terminals allows for multiple connections and functions, increasing the versatility and capabilities of the product.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style enables a compact design, ideal for space-constrained applications while maintaining high performance.

Maximum Operating Temperature: 50 °C

With a maximum operating temperature of 50 °C, the product can withstand high temperatures, ensuring reliable performance in various environments.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0 °C ensures the product can function in cold environments without any issues, increasing its usability.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connectivity, ensuring reliable connections and ease of installation.

Maximum Seated Height: 2 mm

The maximum seated height of 2mm allows for a low-profile design, reducing the overall size of the product and enabling compact installations.

Width: 5.3 mm

Having a width of 5.3mm makes the product compact and space-efficient, ideal for applications where size constraints are a concern.

Length: 7.2 mm

The length of 7.2mm is compact, making the product suitable for small devices and applications where space is limited.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures the product can operate reliably in typical commercial environments, making it suitable for a wide range of applications.

Terminal Form: GULL WING

The gull wing terminal form allows for easy surface mounting and soldering, enhancing the product's durability and reliability.

Maximum Supply Current: 0.025 mA

With a maximum supply current of 0.025mA, the product is energy-efficient, reducing power consumption and operating costs.

Telecom IC Type: TELECOM CIRCUIT

Being a dedicated telecom circuit IC type ensures the product is specifically designed for telecom applications, offering optimized performance and reliability.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V ensures compatibility with standard power sources, making integration into existing systems easier.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, the product allows for precise connections and miniaturization, making it suitable for high-density applications.

Technical Specifications

Other Function Telecom Interface ICs AMIS-52150-XTD attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.025 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

AMIS-52150-XTD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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