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AMIS-52050

Onsemi

AMIS-52050 by Onsemi

AMIS-52050 by Onsemi is a telecom interface IC with 20 terminals in a small outline package. It operates at a nominal voltage of 3V and has a terminal pitch of 0.65mm. This IC is commonly used in telecom circuits for various applications due to its compact size and surface-mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 952 parts In-Stock

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952

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Vyrian

USA . 36 parts In-Stock

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36

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 460 parts In-Stock

1+ parts

$0.198

100+ parts

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$0.190

460

$0.198

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$0.190

Northwest PG Solutions

USA . 1,344 parts In-Stock

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$0.218

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$0.192

1,344

$0.218

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$0.192

Kulean Microsystems

USA . 4,970 parts In-Stock

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4,970

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SupplyDigital Components

Austria . 2,572 parts In-Stock

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2,572

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Problanco Electronics

Mexico . 2,484 parts In-Stock

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2,484

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TANS Electronics

Latvia . 2,233 parts In-Stock

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2,233

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Corphita

USA . 616 parts In-Stock

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616

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Corohmni

South Africa . 357 parts In-Stock

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UHIMA Technologies

Türkiye . 179 parts In-Stock

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Overview

Unleash the power of seamless connectivity with the AMIS-52050 by Onsemi. Crafted with precision and expertise, this versatile telecom interface IC offers unparalleled performance and reliability. Perfect for a wide range of applications, this product provides seamless integration and enhanced functionality. Experience the value of superior quality and innovation with the AMIS-52050, your ultimate solution for all your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and protection for the components inside, making it a reliable choice for telecom applications.

Surface Mount: YES

Surface mount technology enables easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and compatibility with various telecom systems.

Nominal Supply Voltage: 3 V

Operating at a nominal supply voltage of 3V makes this product suitable for low power consumption applications.

Technical Specifications

Other Function Telecom Interface ICs AMIS-52050 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

AMIS-52050 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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