Loading...

AMIS-52100

Onsemi

AMIS-52100 by Onsemi

AMIS-52100 by Onsemi is a telecom IC with 20 terminals in a small outline package. It operates b/w 0 °C to 70°C, with a supply voltage of 3V. Ideal for telecom circuits, it features gull wing terminals and is surface mountable.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

349

-

-

-

-

Vyrian

USA . 66 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

66

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 787 parts In-Stock

1+ parts

$0.506

100+ parts

-

1k+ parts

-

10k+ parts

-

787

$0.506

-

-

-

Northwest PG Solutions

USA . 1,329 parts In-Stock

1+ parts

$0.556

100+ parts

-

1k+ parts

-

10k+ parts

$0.490

1,329

$0.556

-

-

$0.490

SupplyDigital Components

Austria . 7,426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,426

-

-

-

-

TANS Electronics

Latvia . 6,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,275

-

-

-

-

Corphita

USA . 1,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,406

-

-

-

-

UHIMA Technologies

Türkiye . 760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

760

-

-

-

-

Problanco Electronics

Mexico . 757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

757

-

-

-

-

Kulean Microsystems

USA . 399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

399

-

-

-

-

Corohmni

South Africa . 177 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

177

-

-

-

-

Overview

Experience seamless and reliable communication with the AMIS-52100 by Onsemi. Designed with top-notch quality and precision, this telecom interface IC offers unmatched performance and efficiency in various applications. From telecommunication systems to networking equipment, this product guarantees unparalleled value and benefits for customers looking for a superior solution. Trust in Onsemi's expertise and innovation to elevate your communication experience to the next level with the AMIS-52100.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and durability, making the product suitable for various operating conditions.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it efficient for compact designs.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into different systems and facilitates efficient PCB layout.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions.

Nominal Supply Voltage: 3 V

Operating at a low nominal supply voltage of 3V makes this product energy-efficient, which is beneficial for power-saving applications.

Technical Specifications

Other Function Telecom Interface ICs AMIS-52100 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

Length:

7.2 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

AMIS-52100 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20