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AMIS-49250-XTP

Onsemi

AMIS-49250-XTP by Onsemi

AMIS-49250-XTP by Onsemi is a telecom IC with 44 terminals, operating at -40 to 85°C. It has a supply voltage of 3V, data rate of 0.03125 Mbps, and power supplies of 3.5V. This square chip carrier package is ideal for industrial telecom applications.

Median Price

$220.300

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 180 parts In-Stock

1+ parts

$16.850

100+ parts

$11.549

1k+ parts

-

10k+ parts

$9.799

180

$16.850

$11.549

-

$9.799

Chip1Stop

Japan . 4,720 parts In-Stock

1+ parts

$423.750

100+ parts

-

1k+ parts

-

10k+ parts

-

4,720

$423.750

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,327 parts In-Stock

1+ parts

$16.824

100+ parts

-

1k+ parts

-

10k+ parts

-

1,327

$16.824

-

-

-

Vyrian

USA . 8,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,366

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 925 parts In-Stock

1+ parts

$0.198

100+ parts

-

1k+ parts

-

10k+ parts

$0.190

925

$0.198

-

-

$0.190

Northwest PG Solutions

USA . 1,689 parts In-Stock

1+ parts

$0.218

100+ parts

-

1k+ parts

-

10k+ parts

$0.192

1,689

$0.218

-

-

$0.192

Corphita

USA . 2,079 parts In-Stock

1+ parts

$15.939

100+ parts

-

1k+ parts

-

10k+ parts

-

2,079

$15.939

-

-

-

Corohmni

South Africa . 157 parts In-Stock

1+ parts

$17.710

100+ parts

-

1k+ parts

-

10k+ parts

-

157

$17.710

-

-

-

Microchip USA

USA . 3,979 parts In-Stock

1+ parts

$48.776

100+ parts

-

1k+ parts

-

10k+ parts

-

3,979

$48.776

-

-

-

Perfect Parts

USA . 53,883 parts In-Stock

1+ parts

-

100+ parts

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53,883

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Kulean Microsystems

USA . 6,728 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,728

-

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 5,759 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,759

-

-

-

-

GreenTree Electronics

Israel . 4,820 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,820

-

-

-

-

Problanco Electronics

Mexico . 4,143 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,143

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-

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UHIMA Technologies

Türkiye . 355 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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355

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SupplyDigital Components

Austria . 126 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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126

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TANS Electronics

Latvia . 35 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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35

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-

Overview

Discover the cutting-edge AMIS-49250-XTP by Onsemi, a game-changer in the world of telecom interface ICs. With a focus on quality and innovation, Onsemi delivers unmatched performance and reliability. This versatile product is perfect for a wide range of applications, offering seamless integration and superior functionality. Experience the value and benefits of the AMIS-49250-XTP, designed to exceed your expectations and elevate your projects to new heights. Choose Onsemi for excellence in every detail.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and effort in manufacturing processes.

Package Shape: SQUARE

Square shape makes the IC compact and space-efficient, ideal for applications where board space is limited.

Power Supplies (V): 3.5

Operates at a standard voltage level, ensuring compatibility with various systems and reducing the need for additional voltage regulators.

No. of Terminals: 44

Provides a wide range of connectivity options for interfacing with different components or systems, enhancing versatility.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers good thermal conductivity and protection for the IC, ensuring reliability in operation.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, making it suitable for industrial applications with demanding operating conditions.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, expanding the range of environments where this IC can be used.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and electrical conductivity, ensuring a reliable connection on PCBs.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection, simplifying assembly processes.

Maximum Seated Height: 0.9 mm

Low profile design saves space and allows for compact PCB layouts, ideal for small form factor devices.

Width: 7 mm

Compact width allows for efficient use of board space, suitable for applications with tight layout constraints.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during manufacturing processes, ensuring proper soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables lead-free soldering processes, complying with RoHS regulations.

Length: 7 mm

Compact length contributes to the overall small footprint of the IC, suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions, making it suitable for rugged applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and enhances reliability in high temperature environments.

Maximum Supply Current: 0.0008 mA

Low supply current consumption ensures energy efficiency, ideal for battery-powered or low-power applications.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, providing tailored features and performance for telecommunication systems.

Nominal Supply Voltage: 3 V

Standard nominal supply voltage simplifies power management and compatibility with existing systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for dense, compact connections on PCBs, suitable for high-density circuit designs.

Data Rate: 0.03125 Mbps

Supports moderate data rates, suitable for telecom applications requiring reliable data transmission.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, necessitating proper handling and storage practices to maintain reliability.

Technical Specifications

Other Function Telecom Interface ICs AMIS-49250-XTP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

Data Rate:

.03125 Mbps

JESD-30 Code:

S-XQCC-N44

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC44,.28SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3,5

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.0008 mA

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

AMIS-49250-XTP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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