Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STHVDAC-253MF3
STMicroelectronics
STHVDAC-253MF3 by STMicroelectronics is a 16-terminal IC with plastic package, suitable for telecom circuits. It operates b/w -30 °C to 85°C, with a nominal voltage of 3.3V. The grid array package style has very thin profile and fine pitch, making it ideal for telecom interface applications.
R-PBGA-B16
1.7 mm
1
16
85 Cel
-30 Cel
PLASTIC/EPOXY
VFBGA
RECTANGULAR
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
NOT SPECIFIED
.655 mm
3.3 V
YES
TELECOM CIRCUIT
OTHER
BALL
.4 mm
BOTTOM
1.6 mm
XCC2564MODNCMOET
Texas Instruments
Texas Instruments XCC2564MODNCMOET is a 33-terminal SQUARE CHIP CARRIER IC with operating temperatures from -20 to 70°C. It's a TELECOM CIRCUIT suitable for telecom interfaces, featuring a nominal voltage of 3.6V and surface mount compatibility.
S-XBCC-B33
7 mm
33
70 Cel
-20 Cel
UNSPECIFIED
BCC
SQUARE
CHIP CARRIER
1.4 mm
3.6 V
BUTT
SN761634RTWR
SN761634RTWR by Texas Instruments is a telecom interface IC with 24 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it has a nominal voltage of 3V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features nickel palladium gold terminal finish.
S-PQCC-N24
e4
4 mm
2
24
HVQCCN
LCC24,.16SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
260
3
Not Qualified
.8 mm
Other Telecom ICs
3 V
NICKEL PALLADIUM GOLD
NO LEAD
.5 mm
QUAD
30
TDA5101
Infineon Technologies
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;
R-PDSO-G16
5 mm
-25 Cel
TSSOP
TSSOP16,.25
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.2 mm
BIPOLAR
GULL WING
.65 mm
DUAL
4.4 mm
MAX3277U/D
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 9; Package Code: DIE; Package Shape: RECTANGULAR;
R-XUUC-N9
e0
9
0 Cel
DIE
DIE OR CHIP
UNCASED CHIP
3.3
.041 mA
TIN LEAD
UPPER
RI-I16-112A-03
TELECOM CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Maximum Operating Temperature: 70 Cel; Peak Reflow Temperature (C): NOT SPECIFIED; No. of Functions: 1;
RI-I17-112A-03
TELECOM CIRCUIT; Temperature Grade: OTHER; Peak Reflow Temperature (C): NOT SPECIFIED; No. of Functions: 1; Minimum Operating Temperature: -25 Cel; Maximum Operating Temperature: 70 Cel;
AD61009ARSRL
Analog Devices
AD61009ARSRL by Analog Devices is a telecom IC with 20 terminals in a small outline package. It operates b/w -25 °C to 85°C, with a nominal voltage of 3V. This Gull Wing terminal IC is ideal for telecom circuit applications due to its compact size and surface-mount capability.
R-PDSO-G20
7.2 mm
20
SSOP
SMALL OUTLINE, SHRINK PITCH
240
2 mm
5.3 mm
MAX3953UGK
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 68; Package Code: HVQCCN; Package Shape: SQUARE;
S-XQCC-N68
10 mm
68
LCC68,.45SQ,20
.9 mm
ATM/SONET/SDH ICs
.58 mA
HPA01195YFPR
Texas Instruments HPA01195YFPR is a 28-terminal IC with a rectangular shape and very thin profile. Operating b/w 0-125°C, it has a peak reflow temperature of 260°C. Ideal for telecom circuits, it features a nominal voltage of 5V and tin/silver/copper terminal finish.
R-PBGA-B28
e1
3 mm
28
125 Cel
5 V
Tin/Silver/Copper (Sn/Ag/Cu)
1.88 mm
RI-TRP-W9VS-30
TELECOM CIRCUIT; Temperature Grade: OTHER; No. of Functions: 1; Maximum Operating Temperature: 70 Cel; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
AD8316ARM-REEL7
AD8316ARM-REEL7 by Analog Devices is a telecom IC with 10 terminals, operating at -30 to 85 °C. It has a supply voltage of 2.7V and low current draw of 0.012mA. The small outline package is surface-mountable and ideal for telecom interface applications.
S-PDSO-G10
10
TSSOP10,.19,20
3/5
1.1 mm
.012 mA
2.7 V
ADN2820ACHIPS
Analog Devices' ADN2820ACHIPS is a 14-terminal telecom IC with 3.3V supply voltage, operating b/w -15 °C to 85°C. This bipolar technology chip is surface-mountable and uncased, suitable for telecom circuit applications requiring a compact rectangular package.
R-XUUC-N14
14
-15 Cel
SI4735-B20-GMR
Silicon Labs
SI4735-B20-GMR by Silicon Labs is a telecom IC with 20 terminals in a square chip carrier package. Operating temperature ranges from -20 to 85°C. With a very thin profile, it's ideal for telecom circuit applications requiring surface mount technology.
S-XQCC-N20
.6 mm
ONET9901TAY
ONET9901TAY by Texas Instruments is a telecom interface IC with 18 terminals, operating at 3.3V. It features a max supply current of 0.041mA and operates b/w temperatures of 0°C to 85°C. This rectangular surface-mount chip is ideal for telecom circuit applications.
R-XUUC-N18
18
CR14-MQP/1GE
CR14-MQP/1GE by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates at 5V with a max temp of 85 °C and features 16 terminals in a compact SO package. Ideal for telecom circuits, it ensures reliable performance in various environments.
9.9 mm
SOP
SOP16,.25
SMALL OUTLINE
5
1.75 mm
.02 mA
CMOS
1.27 mm
3.9 mm
AD8315ACPZ-REEL7
AD8315ACPZ-REEL7 by Analog Devices is a Telecom IC with 8 terminals, operating at -30 to 85 °C. It has a supply voltage of 2.7V and consumes 0.0129mA current. This small outline package IC is ideal for telecom circuits requiring precise bipolar technology in compact designs.
R-XDSO-N8
e3
8
HVSON
SOLCC8,.08,20
1 mm
.0129 mA
MATTE TIN
AD9860BSTZ
AD9860BSTZ by Analog Devices is a 3.3V CMOS Telecom IC with 128 terminals in a flatpack package. It operates b/w -40 to 70 °C, has matte tin finish, and is suitable for telecom circuit applications due to its low profile design and fine pitch style.
R-PQFP-G128
20 mm
128
-40 Cel
LFQFP
QFP128,.63X.87,20
FLATPACK, LOW PROFILE, FINE PITCH
14 mm
AD9860BSTZRL
AD9860BSTZRL by Analog Devices is a 3.3V CMOS Telecom IC with 128 terminals in a flatpack, low profile package. It operates b/w -40 to 70 °C and features matte tin terminal finish. Ideal for telecom circuits requiring fine pitch and surface mount technology.
AD9862BSTZ
AD9862BSTZ by Analog Devices is a Telecom Interface IC with 128 terminals, operating at 3.3V. It features a CMOS technology, matte tin terminal finish, and low profile flatpack package style. Ideal for telecom circuits, it has a temperature range of -40 to 70 °C and measures 20x14mm in size.
AD6652BBCZ
AD6652BBCZ by Analog Devices is a 256-terminal IC with CMOS technology. It operates b/w -40 to 70°C, suitable for telecom circuits with a 2.5V supply voltage requirement. The package is a square grid array measuring 17x17mm, designed for surface mount applications.
S-PBGA-B256
17 mm
256
BGA
GRID ARRAY
2.5 V
TIN SILVER COPPER
AD8315ARMZ
AD8315ARMZ by Analog Devices is a telecom IC with 8 terminals, operating at -30 to 85°C. It has a supply voltage of 2.7V and consumes 0.0129mA current. The IC is used in telecom circuits for signal processing applications.
S-PDSO-G8
TSSOP8,.19
AD8315ARMZ-RL
AD8315ARMZ-RL by Analog Devices is a telecom IC with 8 terminals, operating at -30 to 85 °C. It has a supply voltage of 2.7V and consumes 0.0129mA current. This small outline IC in plastic package is ideal for telecom interface applications.
RN4020BCN-V/RM120
Microchip Technology
RN4020BCN-V/RM120 by Microchip Technology is a telecom IC with 24 terminals, operating at -30 to 85°C. It has a data rate of 1 Mbps and operates at 3.3V supply voltage. This surface-mount IC is ideal for telecom circuit applications due to its TS16949 screening level and compact rectangular package design.
1 Mbps
R-XXMA-N24
19.5 mm
XMA
MODULE,24LEAD(UNSPEC)
MICROELECTRONIC ASSEMBLY
TS 16949
2.38 mm
GOLD OVER NICKEL
11.5 mm
PN7150B0HN/C11004E
NXP Semiconductors
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N40
6 mm
40
LCC40,.24SQ,20
2.75 V
PN7150B0HN/C11004Y
BGS13SL9E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 9; Package Code: BCC; Package Shape: SQUARE;
S-XBCC-B9
1.15 mm
.32 mm
OL2300NHN/F,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N16
LCC16,.12SQ,20
2.7
19 mA
OL2311AHN/C0B,515
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N32
2A
32
LCC32,.2SQ,20
.85 mm
21.5 mA
OL2381AHN/C0B,515
OL2381AHN/C0B,515 by NXP Semiconductors is a telecom interface IC with 32 terminals in a square chip carrier package. Operating at 2.7V, it has a temperature range of -25 to 85°C and low supply current of 0.0012mA. Ideal for telecom circuits, this IC is surface mountable and features a very thin profile for compact applications.
.0012 mA
SL3S1001FTT,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
80 Cel
BGS16MN14E6327XTSA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N14
.77 mm
3.5 V
Tin (Sn)
TRPGR30ENATGB
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -25 Cel; Package Body Material: UNSPECIFIED;
31.2 mm
3.85 mm
RI-TRP-R9BK-20
TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Qualification: Not Qualified; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Maximum Operating Temperature: 70 Cel;
PN5120A0HN1/C2,151
NXP Semiconductors PN5120A0HN1/C2,151 is a telecom IC with 32 terminals and operates at -30 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. This chip carrier package is suitable for telecom circuits requiring low-profile components.
1.8/3.3,2.5/3.3
GS2971-IBE3
Semtech
Semtech's GS2971-IBE3 is a telecom IC with 100 terminals in a square grid array package. Operating temp range -20 to 85°C, terminal pitch of 1mm, and nominal voltage of 1.2V make it ideal for telecom circuit applications. The low-profile design with tin silver copper finish and ball terminal form ensures reliable performance.
S-PBGA-B100
11 mm
100
LBGA
GRID ARRAY, LOW PROFILE
1.2 V
PN5180A0ET/C1,151
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;
S-PBGA-B64
5.5 mm
64
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
1.8 V
PN5180A0HN/C1,551
TCP-4112UB-DT
Onsemi
TCP-4112UB-DT by Onsemi is a Telecom IC with 4 terminals in a grid array package. It operates b/w -30 °C to 85°C, with terminal finish in nickel gold. With a very thin profile of 0.345mm, it is suitable for telecom circuit applications.
R-PBGA-B4
.626 mm
4
.345 mm
NICKEL GOLD
.42 mm
.609 mm
STHVDAC-256MTGF3
STHVDAC-256MTGF3 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates b/w -30 °C to 85 °C, with a nominal voltage of 3.3V and features a very thin profile in a 20-terminal grid array package. Ideal for compact telecom systems, it ensures efficient signal processing.
R-PBGA-B20
2.23 mm
.64 mm
1.94 mm
TCP-4182UB-DT
TCP-4182UB-DT by Onsemi is a telecom IC with 4 terminals, nickel gold finish, and very thin profile. It operates b/w -30 to 85 °C, suitable for telecom circuit applications requiring fine pitch grid array packaging.
1.009 mm
AD9671KBCZ
AD9671KBCZ by Analog Devices is a 144-terminal GRID ARRAY IC with low profile and fine pitch. Operating b/w 0-85°C, it has a supply voltage of 1.4V and terminal pitch of 0.8mm. Ideal for telecom circuits, its package is made of PLASTIC/EPOXY and is surface mountable for various applications.
S-PBGA-B144
144
LFBGA
GRID ARRAY, LOW PROFILE, FINE PITCH
1.4 V
AD9670BBCZ
AD9670BBCZ by Analog Devices is a 144-terminal telecom IC with a 1.4V supply voltage. It features a low profile grid array package, operates b/w 0-85°C, and has a peak reflow temperature of 260°C. Ideal for telecom circuit applications requiring fine pitch components in a compact form factor.
RI-I11-114A-01
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: SQUARE; Terminal Position: UNSPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
S-XXSS-X
SPECIAL SHAPE
NO
RI-STU-251B-01
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Terminal Position: UNSPECIFIED;
R-XXSS-X
RI-STU-251B-30
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Surface Mount: NO; Terminal Position: UNSPECIFIED;
MFRC52302HN1,151
NXP Semiconductors' MFRC52302HN1,151 is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for applications requiring a very thin profile and surface mount compatibility.
BT111-A-HCI
Silicon Labs' BT111-A-HCI is a surface-mount telecom IC with 21 terminals. Operating temp range: -30 to 85°C, compact size: 13.05mm x 9.3mm x 2.31mm. Ideal for applications requiring a small form factor and reliable telecom circuit performance.
R-XXMA-N21
13.05 mm
21
2.31 mm
9.3 mm
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