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SN761634RTWR

Texas Instruments

SN761634RTWR by Texas Instruments

SN761634RTWR by Texas Instruments is a telecom interface IC with 24 terminals in a square chip carrier package. Operating b/w -20°C to 85°C, it has a nominal voltage of 3V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features nickel palladium gold terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,646 parts In-Stock

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3,646

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Digiode

USA . 1,173 parts In-Stock

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1,173

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,119 parts In-Stock

1+ parts

$6.453

100+ parts

-

1k+ parts

$7.197

10k+ parts

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2,119

$6.453

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$7.197

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ChromeModa Solutions

Germany . 2,024 parts In-Stock

1+ parts

$7.251

100+ parts

$5.946

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2,024

$7.251

$5.946

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IDEA Electronic Components Group

UK . 1,756 parts In-Stock

1+ parts

$7.251

100+ parts

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$6.526

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1,756

$7.251

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$6.526

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AZTECH Wire

Italy . 573 parts In-Stock

1+ parts

$15.779

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573

$15.779

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One Stop Electronics

USA . 675 parts In-Stock

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$436.000

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675

$436.000

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A-Z Elektronik GmbH

Germany . 6,108 parts In-Stock

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6,108

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Lixinc

USA . 4,840 parts In-Stock

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4,840

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Corphita

USA . 4,458 parts In-Stock

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4,458

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Assy Fe

Spain . 3,400 parts In-Stock

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3,400

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Kepictronics

USA . 2,756 parts In-Stock

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2,756

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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DigiPath Technology Company

USA . 1,525 parts In-Stock

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$6.538

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1,525

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$6.538

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Microchip USA

USA . 247 parts In-Stock

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247

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Overview

Experience unparalleled quality and innovation with the SN761634RTWR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-of-the-line telecom interface ICs that are designed for peak performance and reliability. This versatile chip carrier is perfect for a wide range of applications, offering customers unmatched value and benefits. Trust Texas Instruments to provide you with the cutting-edge technology you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for portable devices.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Power Supplies (V): 3

Operating at a low power supply voltage of 3V helps in minimizing power consumption and improving energy efficiency.

No. of Terminals: 24

Having 24 terminals provides flexibility for interfacing with other components, allowing for versatile connectivity options.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperature environments without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances conductivity and corrosion resistance, ensuring reliable connections.

Width: 4 mm

The compact width of 4mm makes the product space-efficient, ideal for applications with limited board space.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and solder joint reliability during assembly processes.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type offers optimized performance and compatibility for telecommunication systems.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V provides stable power delivery for consistent performance, crucial for telecom interfaces.

Technical Specifications

Other Function Telecom Interface ICs SN761634RTWR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

SN761634RTWR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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