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SN761631PAP

Texas Instruments

SN761631PAP by Texas Instruments

SN761631PAP by Texas Instruments is a telecom interface IC with 64 terminals in a square package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include gull wing terminals, 5V supply voltage, and thin profile flatpack style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,476 parts In-Stock

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9,476

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Digiode

USA . 1,322 parts In-Stock

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1,322

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,550 parts In-Stock

1+ parts

$5.927

100+ parts

-

1k+ parts

$6.712

10k+ parts

-

1,550

$5.927

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$6.712

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ChromeModa Solutions

Germany . 5,104 parts In-Stock

1+ parts

$6.660

100+ parts

$5.461

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5,104

$6.660

$5.461

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IDEA Electronic Components Group

UK . 331 parts In-Stock

1+ parts

$6.660

100+ parts

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$5.994

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331

$6.660

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$5.994

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AZTECH Wire

Italy . 597 parts In-Stock

1+ parts

$11.688

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597

$11.688

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Ampacity Inc.

Singapore . 1,299 parts In-Stock

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$281.000

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1,299

$281.000

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One Stop Electronics

USA . 167 parts In-Stock

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$463.000

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167

$463.000

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Semicontronic

India . 704 parts In-Stock

1+ parts

$968.000

100+ parts

$943.800

1k+ parts

$938.960

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704

$968.000

$943.800

$938.960

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Corphita

USA . 4,023 parts In-Stock

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4,023

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DigiPath Technology Company

USA . 471 parts In-Stock

1+ parts

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$6.005

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471

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$6.005

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Corohmni

South Africa . 407 parts In-Stock

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407

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Overview

Enhance your telecommunications projects with the SN761631PAP by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge solutions for telecom interface ICs. This product offers unmatched value, providing seamless connectivity and reliable performance. Whether you're designing communication systems or networking equipment, this versatile component is sure to elevate your projects to the next level. Trust Texas Instruments to deliver the excellence you need in every aspect of your design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring reliable performance over time.

Surface Mount: YES

Surface mountability allows for easier and more efficient assembly processes, saving time and cost during production.

Package Shape: SQUARE

The square package shape helps in optimizing space utilization on circuit boards, making it suitable for compact electronic designs.

No. of Terminals: 64

With 64 terminals, this product provides sufficient connectivity options for various telecom interface applications.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The diverse package styles offer flexibility in mounting options and heat dissipation, catering to different design requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the device can withstand challenging environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in cold environments, enhancing the product's versatility.

Terminal Position: QUAD

The quad terminal position facilitates easy connections and maintenance of the interface IC, contributing to overall usability.

Maximum Seated Height: 1.2 mm

The low maximum seated height enables a slimmer profile for the product, which can be advantageous in space-constrained applications.

Width: 10 mm

The compact width of the product adds to its versatility and compatibility with various board layouts in telecom equipment.

Length: 10 mm

The small length of the product contributes to its space-saving design, making it suitable for applications with limited space availability.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh operating environments, making it suitable for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form provides secure and robust connections, enhancing the product's reliability and longevity.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this IC type offers optimized performance and compatibility with telecom systems.

Nominal Supply Voltage: 5 V

The 5V supply voltage is commonly used in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch provides a fine pitch spacing for increased connectivity options in a compact package, making it suitable for high-density designs.

Technical Specifications

Other Function Telecom Interface ICs SN761631PAP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

SN761631PAP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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