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SN76832N

Texas Instruments

SN76832N by Texas Instruments

The Texas Instruments SN76832N is a telecom interface IC with 16 terminals in an in-line package. Operating temperature range of 0-70°C, suitable for commercial applications. Features bipolar technology and terminal pitch of 2.54mm, ideal for telecom circuit designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,555 parts In-Stock

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6,555

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Digiode

USA . 4,028 parts In-Stock

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4,028

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Corel Iberica Componentes, S.L.

Spain . 183 parts In-Stock

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183

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GES GmbH

Germany . 51 parts In-Stock

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51

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Parana Technologies

USA . 1,871 parts In-Stock

1+ parts

$8.437

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$9.079

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1,871

$8.437

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$9.079

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AZTECH Wire

Italy . 639 parts In-Stock

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$9.241

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639

$9.241

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ChromeModa Solutions

Germany . 6,400 parts In-Stock

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$9.480

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$7.774

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$9.480

$7.774

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IDEA Electronic Components Group

UK . 694 parts In-Stock

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$9.480

100+ parts

$9.006

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$8.532

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694

$9.480

$9.006

$8.532

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One Stop Electronics

USA . 1,180 parts In-Stock

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$220.000

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$220.000

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Corphita

USA . 1,582 parts In-Stock

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1,582

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DigiPath Technology Company

USA . 598 parts In-Stock

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$8.547

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598

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$8.547

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Assy Fe

Spain . 17 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the Texas Instruments SN76832N. As a leader in semiconductor innovation, Texas Instruments brings you a cutting-edge product that meets the highest industry standards. Designed for a wide range of telecom applications, this IC offers exceptional performance and durability. Trust in Texas Instruments to deliver superior technology and value, ensuring seamless integration and optimal functionality for all your telecommunications needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, reducing the overall weight of the device it is used in.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various designs and layouts, making it versatile for different applications.

No. of Terminals: 16

With 16 terminals, this product enables a higher level of connectivity and functionality, making it suitable for more complex telecom interface applications.

Package Style (Meter): IN-LINE

The in-line package style provides a simple and compact form factor, saving space on the circuit board and making it easier to implement in tight spaces.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance in various operating conditions, making it a dependable choice for telecom applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the product can function even in colder environments, increasing its versatility.

Terminal Position: DUAL

The dual terminal position allows for more secure and stable connections, reducing the risk of disconnection or signal loss in high-vibration environments.

Temperature Grade: COMMERCIAL

Rated for commercial use, this product is suitable for a wide range of applications in commercial telecom systems, ensuring compatibility with industry standards.

Technology: BIPOLAR

Utilizing bipolar technology provides high-speed performance and precision, making it ideal for telecom interface applications that require fast data processing and accurate signal transmission.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures easy installation on a circuit board, enhancing the product's ease of use and simplifying the manufacturing process.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and reliability in telecom applications, ensuring seamless connectivity and data transmission.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy connection with standard pin headers and connectors, enabling compatibility with a wide range of existing systems and devices.

Technical Specifications

Other Function Telecom Interface ICs SN76832N attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

NO

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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