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SN76606N

Texas Instruments

SN76606N by Texas Instruments

SN76606N by Texas Instruments is a telecom interface IC with 28 terminals in an in-line rectangular package. Operating temperature range of 0-50°C, suitable for commercial use. Utilizes bipolar technology for telecom circuits with terminal pitch of 2.54mm, ideal for telecommunications applications.

Median Price

$10.120

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 1 parts In-Stock

1+ parts

$10.120

100+ parts

-

1k+ parts

-

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1

$10.120

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-

-

Vyrian

USA . 5,784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,784

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Digiode

USA . 4,003 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,003

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,765 parts In-Stock

1+ parts

$8.825

100+ parts

-

1k+ parts

$9.511

10k+ parts

-

1,765

$8.825

-

$9.511

-

DigiPath Technology Company

USA . 812 parts In-Stock

1+ parts

$9.718

100+ parts

$8.940

1k+ parts

-

10k+ parts

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812

$9.718

$8.940

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ChromeModa Solutions

Germany . 2,701 parts In-Stock

1+ parts

$9.916

100+ parts

$8.131

1k+ parts

-

10k+ parts

-

2,701

$9.916

$8.131

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IDEA Electronic Components Group

UK . 1,773 parts In-Stock

1+ parts

$9.916

100+ parts

$9.420

1k+ parts

$8.924

10k+ parts

-

1,773

$9.916

$9.420

$8.924

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AZTECH Wire

Italy . 698 parts In-Stock

1+ parts

$10.769

100+ parts

-

1k+ parts

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698

$10.769

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One Stop Electronics

USA . 1,238 parts In-Stock

1+ parts

$475.000

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1,238

$475.000

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Corphita

USA . 4,769 parts In-Stock

1+ parts

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100+ parts

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4,769

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Overview

Enhance your telecom interface systems with the SN76606N from Texas Instruments. Known for their high-quality products, Texas Instruments delivers exceptional performance and reliability in every component they create. The SN76606N is perfect for a variety of applications in the telecom industry, offering seamless integration and superior functionality. With its durable construction and advanced technology, this telecom circuit IC will provide unmatched value and benefits to customers looking for top-tier solutions. Upgrade your systems today with the SN76606N and experience the difference that Texas Instruments can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a durable material that ensures the package can withstand external factors and maintain product integrity.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various electronic devices and circuit layouts.

No. of Terminals: 28

Having 28 terminals enables versatility in connectivity options and compatibility with different systems.

Package Style (Meter): IN-LINE

In-line package style allows for space-efficient placement within a circuit design.

Maximum Operating Temperature: 50 °C

With a high maximum operating temperature, this product can reliably function in various environments without overheating.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can perform effectively even in colder conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal transmission capabilities.

Temperature Grade: COMMERCIAL

Commercial grade ensures this product meets industry standards and reliability for widespread use.

Technology: BIPOLAR

Bipolar technology offers stable performance and efficient signal processing for telecom applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure connections and ease of soldering during assembly.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring optimized functionality and compatibility for communication systems.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54 mm allows for easy integration and compatibility with various PCB designs.

Technical Specifications

Other Function Telecom Interface ICs SN76606N attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

NO

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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