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SN76607N

Texas Instruments

SN76607N by Texas Instruments

SN76607N by Texas Instruments is a telecom interface IC with 20 terminals in an in-line package. Operating temperature range of 0-50°C, suitable for commercial use. Features bipolar technology and through-hole terminal form, ideal for telecom circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,679 parts In-Stock

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8,679

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Digiode

USA . 1,082 parts In-Stock

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1,082

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Electronic Expediters

USA . 120 parts In-Stock

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120

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Distributors (Availability)

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$9.050

100+ parts

$8.959

1k+ parts

$8.597

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1,000

$9.050

$8.959

$8.597

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Parana Technologies

USA . 356 parts In-Stock

1+ parts

$12.367

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$12.806

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356

$12.367

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$12.806

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DigiPath Technology Company

USA . 1,349 parts In-Stock

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$13.618

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$12.529

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1,349

$13.618

$12.529

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ChromeModa Solutions

Germany . 3,167 parts In-Stock

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$13.896

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$11.395

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3,167

$13.896

$11.395

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IDEA Electronic Components Group

UK . 2,067 parts In-Stock

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$13.896

100+ parts

$13.201

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$12.506

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2,067

$13.896

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$12.506

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AZTECH Wire

Italy . 212 parts In-Stock

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$16.670

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212

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One Stop Electronics

USA . 1,205 parts In-Stock

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$777.000

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$777.000

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Corphita

USA . 3,526 parts In-Stock

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Overview

Elevate your telecommunications systems with the Texas Instruments SN76607N. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. The SN76607N falls under the category of Other Function Telecom Interface ICs, offering seamless integration and advanced functionality. With its innovative technology and durable construction, this telecom circuit IC is designed to withstand a wide range of operating temperatures while delivering superior performance. Upgrade your communication systems today with the SN76607N and experience unparalleled value and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/epoxy material provides durability and protection for the IC, ensuring a longer lifespan.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate this IC into existing telecom systems.

No. of Terminals: 20

Having 20 terminals allows for flexibility in connectivity options within the telecom system.

Package Style (Meter): IN-LINE

In-line package style saves space and makes installation and connection straightforward.

Maximum Operating Temperature: 50 °C

High maximum operating temperature ensures stable performance even under demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature means this IC can function effectively in a wide range of environments.

Terminal Position: DUAL

Dual terminal position allows for efficient routing and connectivity within the telecom system.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates this IC is suitable for standard commercial applications.

Technology: BIPOLAR

Bipolar technology offers reliable performance and efficiency in telecom interface applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure connections and ease of soldering during installation.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring compatibility and optimal performance in telecommunications systems.

Terminal Pitch: 2.54 mm

Terminal pitch of 2.54mm allows for easy integration and connection with standard components in telecom systems.

Technical Specifications

Other Function Telecom Interface ICs SN76607N attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

NO

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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