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SN761633RTAR

Texas Instruments

SN761633RTAR by Texas Instruments

SN761633RTAR by Texas Instruments is a telecom interface IC with 1 function. It has a square package shape, 40 terminals, and a max seated height of 0.8 mm. This IC is suitable for telecom circuit applications.

Median Price

$3.390

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 13,680 parts In-Stock

1+ parts

-

100+ parts

$3.390

1k+ parts

-

10k+ parts

-

13,680

-

$3.390

-

-

Rochester

USA . 7,700 parts In-Stock

1+ parts

-

100+ parts

$2.940

1k+ parts

$2.630

10k+ parts

$2.470

7,700

-

$2.940

$2.630

$2.470

Verical

USA . 7,700 parts In-Stock

1+ parts

-

100+ parts

$3.862

1k+ parts

$3.288

10k+ parts

-

7,700

-

$3.862

$3.288

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 77 parts In-Stock

1+ parts

$2.910

100+ parts

-

1k+ parts

-

10k+ parts

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77

$2.910

-

-

-

Digiode

USA . 202 parts In-Stock

1+ parts

$3.097

100+ parts

-

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202

$3.097

-

-

-

DigiKey Marketplace

USA . 17,280 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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17,280

-

-

-

-

Vyrian

USA . 13,414 parts In-Stock

1+ parts

-

100+ parts

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13,414

-

-

-

-

PC Components Company LLC

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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17

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Bristol Electronics

USA . 17 parts In-Stock

1+ parts

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100+ parts

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17

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EMSNET

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 13,079 parts In-Stock

1+ parts

$2.770

100+ parts

-

1k+ parts

-

10k+ parts

-

13,079

$2.770

-

-

-

Continental Prestige Electronics

USA . 1,321 parts In-Stock

1+ parts

$2.910

100+ parts

-

1k+ parts

-

10k+ parts

$2.852

1,321

$2.910

-

-

$2.852

Argo Parts USA

USA . 467 parts In-Stock

1+ parts

$2.910

100+ parts

-

1k+ parts

-

10k+ parts

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467

$2.910

-

-

-

Corphita

USA . 2,105 parts In-Stock

1+ parts

$2.934

100+ parts

-

1k+ parts

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10k+ parts

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2,105

$2.934

-

-

-

Parana Technologies

USA . 1,091 parts In-Stock

1+ parts

$13.308

100+ parts

-

1k+ parts

$13.815

10k+ parts

-

1,091

$13.308

-

$13.815

-

DigiPath Technology Company

USA . 1,635 parts In-Stock

1+ parts

$14.654

100+ parts

-

1k+ parts

-

10k+ parts

-

1,635

$14.654

-

-

-

ChromeModa Solutions

Germany . 2,780 parts In-Stock

1+ parts

$14.953

100+ parts

$12.261

1k+ parts

-

10k+ parts

-

2,780

$14.953

$12.261

-

-

IDEA Electronic Components Group

UK . 1,365 parts In-Stock

1+ parts

$14.953

100+ parts

$14.205

1k+ parts

$13.458

10k+ parts

-

1,365

$14.953

$14.205

$13.458

-

Lixinc

USA . 7,584 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,584

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-

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A-Z Elektronik GmbH

Germany . 6,837 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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6,837

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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100+ parts

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4,000

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-

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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-

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Kepictronics

USA . 560 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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560

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Bastille Electronics

Australia . 50 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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50

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-

-

Overview

Experience high-quality telecommunications performance with the SN761633RTAR by Texas Instruments. As a leading manufacturer, Texas Instruments ensures top-notch reliability and durability in their products. The SN761633RTAR is part of the Other Function Telecom Interface ICs category, offering versatile applications for various telecom circuits. With its compact chip carrier package style and very thin profile, it guarantees space-saving integration. Benefit from its nominal supply voltage of 3V and exceptional temperature range from -20°C to 85°C. Discover the value and advantages this product brings, providing seamless connectivity and efficient telecom operations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The sturdy plastic/epoxy material ensures durability and reliability, making it an excellent choice for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation and integration onto circuit boards, making it convenient and efficient to use.

No. of Functions: 1

This product offers a single function, simplifying design and reducing complexity, which is ideal for specific telecom applications.

Package Shape: SQUARE

The square package shape enables efficient use of space, making it suitable for compact devices and ensuring optimal utilization of limited board real estate.

No. of Terminals: 40

With a substantial number of terminals, this product provides versatility and connectivity options, making it a flexible solution for various Telecom Interface IC applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The chip carrier package style with a heat sink/slug and a very thin profile enhances heat dissipation and compactness, ensuring efficient operation and saving valuable space.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85°C ensures reliability and stability, making it suitable for demanding telecom environments.

Minimum Operating Temperature: -20 °C

The product's capability to operate at a minimum temperature of -20°C makes it suitable for a wide range of telecom applications, including extreme temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish guarantees high conductivity, corrosion resistance, and long-lasting performance, making it a reliable choice for telecom applications.

Terminal Position: QUAD

The quad terminal position provides additional stability and reliability, ensuring secure connections and optimal signal transmission.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for a compact design and provides flexibility for space-constrained applications.

Width: 6 mm

With a narrow width of 6 mm, this product can fit into tight spaces, allowing for efficient design and compact devices.

Maximum Time At Peak Reflow Temperature (s): 30

The product's capability to withstand a maximum time of 30 seconds at peak reflow temperature ensures reliability during the manufacturing process, making it suitable for automated assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for proper soldering during the manufacturing process, ensuring secure connections and reliable performance.

Length: 6 mm

The compact length of 6 mm enables efficient use of board space, making it ideal for applications where size is a constraint.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead-related issues, ensuring environmental friendliness and compliance with regulations.

Telecom IC Type: TELECOM CIRCUIT

This specific telecom IC type allows for seamless integration into telecom systems, ensuring optimal performance and compatibility.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V ensures compatibility with standard power sources, making it easy to integrate into existing telecom setups.

Terminal Pitch: 0.5 mm

With a compact terminal pitch of 0.5 mm, this product offers high-density packaging, making it suitable for space-constrained designs.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 ensures the proper handling and storage of the product, minimizing the risk of moisture-related damage during assembly and long-term use.

Technical Specifications

Other Function Telecom Interface ICs SN761633RTAR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

SN761633RTAR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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