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HPA01195YFPR

Texas Instruments

HPA01195YFPR by Texas Instruments

Texas Instruments HPA01195YFPR is a 28-terminal IC with a rectangular shape and very thin profile. Operating b/w 0-125°C, it has a peak reflow temperature of 260°C. Ideal for telecom circuits, it features a nominal voltage of 5V and tin/silver/copper terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,014 parts In-Stock

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6,014

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Digiode

USA . 4,279 parts In-Stock

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4,279

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Distributors (Availability)

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AZTECH Wire

Italy . 872 parts In-Stock

1+ parts

$13.185

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872

$13.185

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Parana Technologies

USA . 624 parts In-Stock

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$14.259

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$14.710

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624

$14.259

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$14.710

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DigiPath Technology Company

USA . 46 parts In-Stock

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$15.701

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46

$15.701

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ChromeModa Solutions

Germany . 1,555 parts In-Stock

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$16.021

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$13.137

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1,555

$16.021

$13.137

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IDEA Electronic Components Group

UK . 1,160 parts In-Stock

1+ parts

$16.021

100+ parts

$15.220

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$14.419

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1,160

$16.021

$15.220

$14.419

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One Stop Electronics

USA . 1,290 parts In-Stock

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$463.000

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$463.000

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QUARKTWIN TECHNOLOGY LTD

USA . 28,434 parts In-Stock

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Microchip USA

USA . 2,884 parts In-Stock

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Corphita

USA . 2,488 parts In-Stock

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Overview

Unlock the power of seamless communication with the HPA01195YFPR by Texas Instruments. Designed with precision and reliability in mind, this telecom interface IC offers unparalleled performance for a wide range of applications. From grid arrays to fine pitch terminals, this product boasts top-notch quality and innovative features that set it apart from the rest. Experience the difference with Texas Instruments and elevate your projects to new heights with the HPA01195YFPR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability makes it easy to integrate the IC into circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on the circuit board and maximizes use of space.

No. of Terminals: 28

Having 28 terminals allows for a versatile range of connections and functionality.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even under demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the IC can function in a wide range of environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin/silver/copper provides good conductivity and corrosion resistance for reliable connections.

Maximum Seated Height: 0.5 mm

Low maximum seated height allows for a compact design and easy integration into devices with limited space.

Width: 1.88 mm

Narrow width facilitates efficient placement on the circuit board and helps in optimizing board space.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature ensures that the IC can withstand manufacturing processes without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability enables the IC to undergo reflow soldering processes efficiently.

Length: 3 mm

Compact length allows for flexible positioning on the circuit board and efficient use of space.

Terminal Form: BALL

Ball terminal form provides reliability in interconnecting the IC with other components on the circuit board.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuit applications, ensuring optimized performance in telecommunication systems.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V is commonly used in many electronic devices, making it compatible with a wide range of applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4mm allows for high-density mounting and precise connections in compact spaces.

Technical Specifications

Other Function Telecom Interface ICs HPA01195YFPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PBGA-B28

JESD-609 Code:

e1

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.88 mm

Trade Compliance

HPA01195YFPR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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