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HPA02221RHLR

Texas Instruments

HPA02221RHLR by Texas Instruments

Texas Instruments' HPA02221RHLR is a telecom IC with 20 terminals in a chip carrier package. It features a 1mm seated height, 0.5mm terminal pitch, and measures 3.5mm wide by 4.5mm long. Ideal for telecom circuit applications requiring a very thin profile and heat sink/slug package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,722 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,722

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-

-

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Digiode

USA . 4,529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,529

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 782 parts In-Stock

1+ parts

$8.695

100+ parts

-

1k+ parts

$9.376

10k+ parts

-

782

$8.695

-

$9.376

-

ChromeModa Solutions

Germany . 3,050 parts In-Stock

1+ parts

$9.770

100+ parts

$8.011

1k+ parts

-

10k+ parts

-

3,050

$9.770

$8.011

-

-

IDEA Electronic Components Group

UK . 1,119 parts In-Stock

1+ parts

$9.770

100+ parts

$9.282

1k+ parts

$8.793

10k+ parts

-

1,119

$9.770

$9.282

$8.793

-

AZTECH Wire

Italy . 638 parts In-Stock

1+ parts

$12.234

100+ parts

-

1k+ parts

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10k+ parts

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638

$12.234

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One Stop Electronics

USA . 699 parts In-Stock

1+ parts

$776.000

100+ parts

-

1k+ parts

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10k+ parts

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699

$776.000

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Corphita

USA . 4,795 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,795

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DigiPath Technology Company

USA . 1,378 parts In-Stock

1+ parts

-

100+ parts

$8.809

1k+ parts

-

10k+ parts

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1,378

-

$8.809

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Overview

Discover the innovative HPA02221RHLR by Texas Instruments, a cutting-edge telecom interface IC that sets new standards for quality and performance. Crafted by a trusted manufacturer known for excellence, this chip carrier boasts a very thin profile and heat sink/slug package style, making it perfect for a wide range of applications in the telecom industry. With 20 terminals and a compact design, this product offers unparalleled value and efficiency to customers seeking top-tier solutions for their projects. Experience the benefits of superior engineering and reliability with the HPA02221RHLR - the ultimate choice for your telecom interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product reliable and easy to handle.

Surface Mount: YES

Surface mount capability enables easy and efficient integration into electronic circuit designs.

Package Shape: RECTANGULAR

Rectangular shape allows for compact placement in electronic devices, optimizing space usage.

No. of Terminals: 20

Having 20 terminals provides versatility in connectivity options for various telecom interfaces.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design enhances thermal management and space efficiency.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and reliable electrical connections.

Maximum Seated Height: 1 mm

Low seated height makes the product suitable for slim electronic devices.

Width: 3.5 mm

Narrow width facilitates integration into compact electronic assemblies.

Length: 4.5 mm

Compact length ensures the product can fit into tight spaces within electronic designs.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and reduces potential hazards.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, ensuring optimal performance and compatibility in telecommunications applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and precise connections in electronic circuitry.

Technical Specifications

Other Function Telecom Interface ICs HPA02221RHLR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PQCC-N20

Length:

4.5 mm

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3.5 mm

Trade Compliance

HPA02221RHLR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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