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HPA02243RGZR

Texas Instruments

HPA02243RGZR by Texas Instruments

Texas Instruments' HPA02243RGZR is a 48-terminal telecom IC with 3.3V supply voltage, suitable for telecom circuit applications. It features a square chip carrier package style, nickel palladium gold terminal finish, and compact dimensions of 7mm x 7mm x 1mm for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,978 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,978

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-

-

-

Digiode

USA . 4,658 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,658

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 170 parts In-Stock

1+ parts

$10.204

100+ parts

-

1k+ parts

$10.740

10k+ parts

-

170

$10.204

-

$10.740

-

DigiPath Technology Company

USA . 1,414 parts In-Stock

1+ parts

$11.236

100+ parts

-

1k+ parts

-

10k+ parts

-

1,414

$11.236

-

-

-

ChromeModa Solutions

Germany . 3,420 parts In-Stock

1+ parts

$11.465

100+ parts

$9.401

1k+ parts

-

10k+ parts

-

3,420

$11.465

$9.401

-

-

IDEA Electronic Components Group

UK . 1,337 parts In-Stock

1+ parts

$11.465

100+ parts

$10.892

1k+ parts

$10.318

10k+ parts

-

1,337

$11.465

$10.892

$10.318

-

AZTECH Wire

Italy . 596 parts In-Stock

1+ parts

$16.860

100+ parts

-

1k+ parts

-

10k+ parts

-

596

$16.860

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-

-

Microchip USA

USA . 4,490 parts In-Stock

1+ parts

$19.768

100+ parts

-

1k+ parts

-

10k+ parts

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4,490

$19.768

-

-

-

One Stop Electronics

USA . 186 parts In-Stock

1+ parts

$401.000

100+ parts

-

1k+ parts

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10k+ parts

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186

$401.000

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-

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Corphita

USA . 4,009 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,009

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Overview

Elevate your telecom interface systems with the Texas Instruments HPA02243RGZR. Crafted with precision and expertise, this cutting-edge product is designed to deliver unparalleled performance and reliability. From its innovative design to its advanced features, this telecom IC offers seamless integration and optimal functionality, making it a top choice for a wide range of applications. Upgrade your systems today and experience the quality, value, and advantages that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various telecom applications.

Surface Mount: YES

Easy to mount on a PCB for efficient assembly and space-saving design.

Package Shape: SQUARE

Compact shape for efficient use of space on a circuit board.

No. of Terminals: 48

Sufficient number of terminals for connectivity and functionality in a telecom application.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of styles provide thermal management and space-saving benefits.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable finish for reliable electrical connections and corrosion resistance.

Terminal Position: QUAD

Quad terminal configuration for increased connectivity options and flexibility.

Maximum Seated Height: 1 mm

Low profile design for compact and slim telecom equipment.

Width: 7 mm

Narrow width for efficient placement on a PCB without taking up too much space.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and reliable soldering during manufacturing process.

Peak Reflow Temperature °C: 260

High temperature tolerance for reflow soldering without compromising the product.

Length: 7 mm

Compact length for space-saving design and efficient layout on a PCB.

Terminal Form: NO LEAD

Lead-free terminal form for environmental compliance and safety.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent operation in telecom systems.

Terminal Pitch: 0.5 mm

Fine pitch for high density connections on a PCB, allowing for more features in a compact space.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for reliable performance in various environmental conditions.

Technical Specifications

Other Function Telecom Interface ICs HPA02243RGZR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

HPA02243RGZR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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