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HPA00702F128RHAR

Texas Instruments

HPA00702F128RHAR by Texas Instruments

Texas Instruments HPA00702F128RHAR is a 40-terminal telecom IC with 3V supply voltage, operating from -40 to 125°C. It features nickel palladium gold finish, no-lead terminal form, and quad position for automotive applications. The chip carrier package has a very thin profile, measures 6x6mm in size, and supports surface mount assembly at peak reflow temperature of 260°C within 30 seconds.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,498 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,498

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Vyrian

USA . 2,845 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,845

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,252 parts In-Stock

1+ parts

$6.355

100+ parts

-

1k+ parts

$7.108

10k+ parts

-

2,252

$6.355

-

$7.108

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DigiPath Technology Company

USA . 1,280 parts In-Stock

1+ parts

$6.997

100+ parts

-

1k+ parts

-

10k+ parts

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1,280

$6.997

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ChromeModa Solutions

Germany . 2,586 parts In-Stock

1+ parts

$7.140

100+ parts

$5.855

1k+ parts

-

10k+ parts

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2,586

$7.140

$5.855

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IDEA Electronic Components Group

UK . 272 parts In-Stock

1+ parts

$7.140

100+ parts

-

1k+ parts

$6.426

10k+ parts

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272

$7.140

-

$6.426

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AZTECH Wire

Italy . 541 parts In-Stock

1+ parts

$12.825

100+ parts

-

1k+ parts

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10k+ parts

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541

$12.825

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One Stop Electronics

USA . 367 parts In-Stock

1+ parts

$96.000

100+ parts

-

1k+ parts

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367

$96.000

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Corphita

USA . 815 parts In-Stock

1+ parts

-

100+ parts

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815

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Overview

Discover the ultimate solution for your telecom interface needs with the HPA00702F128RHAR by Texas Instruments. Crafted with precision and expertise, this high-quality product offers unparalleled performance and reliability. The versatile applications of this telecom IC make it an essential component in various industries. Experience seamless connectivity and optimal functionality with this innovative chip carrier. Elevate your projects with the cutting-edge technology and value that Texas Instruments brings to the table. Choose excellence, choose the HPA00702F128RHAR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for telecom ICs due to its durability and resistance to heat and moisture.

Surface Mount: YES

Surface mount technology allows for a compact design and easier assembly, making it suitable for telecom applications.

Package Shape: SQUARE

The square shape helps in efficient use of space on the PCB and provides stability during installation.

No. of Terminals: 40

With a high number of terminals, this IC can accommodate a variety of connections, making it versatile for different telecom applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the IC can withstand harsh environmental conditions often found in telecom equipment.

Nominal Supply Voltage: 3 V

The low supply voltage requirement makes this IC energy-efficient, which is important for telecom devices that are often powered by batteries.

Technical Specifications

Other Function Telecom Interface ICs HPA00702F128RHAR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Trade Compliance

HPA00702F128RHAR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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