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HPA01211RHBR

Texas Instruments

HPA01211RHBR by Texas Instruments

Texas Instruments' HPA01211RHBR is a telecom interface IC with 2 channels, operating at -40 to 85°C. It features a square chip carrier package with 32 terminals, nickel palladium gold finish, and no-lead terminal form. Ideal for industrial applications requiring a nominal voltage of 1.8V and surface mount installation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,768 parts In-Stock

1+ parts

-

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4,768

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Vyrian

USA . 4,601 parts In-Stock

1+ parts

-

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4,601

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 857 parts In-Stock

1+ parts

$13.937

100+ parts

-

1k+ parts

$14.413

10k+ parts

-

857

$13.937

-

$14.413

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DigiPath Technology Company

USA . 2,122 parts In-Stock

1+ parts

$15.346

100+ parts

-

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2,122

$15.346

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ChromeModa Solutions

Germany . 2,422 parts In-Stock

1+ parts

$15.659

100+ parts

$12.840

1k+ parts

-

10k+ parts

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2,422

$15.659

$12.840

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IDEA Electronic Components Group

UK . 1,240 parts In-Stock

1+ parts

$15.659

100+ parts

$14.876

1k+ parts

$14.093

10k+ parts

-

1,240

$15.659

$14.876

$14.093

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AZTECH Wire

Italy . 308 parts In-Stock

1+ parts

$16.546

100+ parts

-

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308

$16.546

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Ampacity Inc.

Singapore . 1,603 parts In-Stock

1+ parts

$140.000

100+ parts

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1,603

$140.000

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One Stop Electronics

USA . 1,285 parts In-Stock

1+ parts

$509.000

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1,285

$509.000

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Semicontronic

India . 355 parts In-Stock

1+ parts

$519.000

100+ parts

$506.025

1k+ parts

$503.430

10k+ parts

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355

$519.000

$506.025

$503.430

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Corphita

USA . 1,495 parts In-Stock

1+ parts

-

100+ parts

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1,495

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Corohmni

South Africa . 176 parts In-Stock

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176

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Overview

Elevate your telecom interface systems with the HPA01211RHBR by Texas Instruments. Manufactured with precision and excellence, this product offers unmatched quality and reliability. Ideal for various applications in the telecom industry, this IC delivers exceptional performance while maintaining a compact design. With its advanced features and cutting-edge technology, customers can expect seamless integration and optimal functionality for their projects. Experience the value and benefits of this innovative product and take your telecom systems to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection for the IC, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Package Shape: SQUARE

Square shape design saves space and allows for efficient placement on circuit boards.

No. of Terminals: 32

Having 32 terminals provides flexibility and connectivity options for the IC.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can function reliably in a wide range of temperature conditions.

Nominal Supply Voltage: 1.8 V

Low supply voltage requirement makes this IC energy efficient and suitable for low-power applications.

Technical Specifications

Other Function Telecom Interface ICs HPA01211RHBR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

HPA01211RHBR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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