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CR14-MQP/1GE

STMicroelectronics

CR14-MQP/1GE by STMicroelectronics

CR14-MQP/1GE by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates at 5V with a max temp of 85 °C and features 16 terminals in a compact SO package. Ideal for telecom circuits, it ensures reliable performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 12,527 parts In-Stock

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Digiode

USA . 2,304 parts In-Stock

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Anansix

USA . 608 parts In-Stock

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608

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Native Components

USA . 135 parts In-Stock

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$1.031

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135

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Northwest PG Solutions

USA . 1,055 parts In-Stock

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$1.135

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$1.135

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IDEA Electronic Components Group

UK . 287 parts In-Stock

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$7.211

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$6.490

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$6.490

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MKK Technologies

India . 278 parts In-Stock

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$13.560

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DigiPath Technology Company

USA . 278 parts In-Stock

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$13.560

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278

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AZTECH Wire

Italy . 1,200 parts In-Stock

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$15.290

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Corphita

USA . 1,060 parts In-Stock

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Perfect Parts

USA . 165 parts In-Stock

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Parana Technologies

USA . 117 parts In-Stock

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$8.622

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Overview

Unlock the potential of your telecom applications with the CR14-MQP/1GE from STMicroelectronics. Renowned for its commitment to quality and innovation, STMicroelectronics delivers this compact, reliable interface IC designed for seamless connectivity and efficient performance. With its robust design and temperature resilience, it’s perfect for diverse environments, ensuring outstanding functionality. Elevate your projects with this expertly engineered solution that brings unparalleled value and reliability to your circuits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good durability and protection against environmental factors, ensuring reliable performance in various conditions.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, making this product ideal for modern electronic circuit boards.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB and facilitates easier integration into tightly packed electronic assemblies.

Power Supplies (V): 5

The compatibility with a standard 5V power supply makes it easy to integrate into existing systems without the need for additional voltage regulators.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options, allowing for versatile functionality and interfacing with various components in telecommunications applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space requirements on the PCB, enabling denser layouts and more efficient use of real estate in circuit designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can function reliably in high-temperature environments, suitable for many telecom applications.

Minimum Operating Temperature: -20 °C

The minimum operating temperature of -20 °C ensures that the product can perform well in cold environments, enhancing its versatility in various settings.

Terminal Position: DUAL

The dual terminal position allows for flexible routing options on the PCB, contributing to more optimized circuit layouts.

Maximum Seated Height: 1.75 mm

A low maximum seated height of 1.75 mm supports slim designs, which is essential in applications where space is at a premium.

Width: 3.9 mm

The narrow width of 3.9 mm helps in achieving tighter spacing between components on a PCB, facilitating more compact designs.

Length: 9.9 mm

With a moderate length of 9.9 mm, this IC strikes a balance between size and functionality, making it suitable for various telecom applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an excellent choice for power-sensitive applications in telecommunications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and reliable connections on the PCB, ensuring robust performance over time.

Maximum Supply Current: 0.02 mA

A low maximum supply current of 0.02 mA contributes to overall system energy efficiency, which is critical for battery-operated devices.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit IC, it is specifically designed to optimize performance in communication applications, making it a targeted choice for telecom engineers.

Nominal Supply Voltage: 5 V

The nominal supply of 5V aligns with common electronic components, simplifying integration into broader systems and reducing design complexity.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for straightforward placement and soldering on PCB, enhancing manufacturability and reliability.

Technical Specifications

Other Function Telecom Interface ICs CR14-MQP/1GE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.02 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

CR14-MQP/1GE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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