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CR14-MQ/XXX

STMicroelectronics

CR14-MQ/XXX by STMicroelectronics

STMicroelectronics CR14-MQ/XXX is a 16-terminal telecom IC with CMOS technology. It operates b/w -20 °C to 85°C, suitable for telecom circuits at 5V supply voltage. The small outline package measures 9.9mm x 3.9mm x 1.75mm, making it ideal for surface mount applications in telecommunications interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,707 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,707

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-

-

-

Anansix

USA . 2,410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,410

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-

-

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Digiode

USA . 232 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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232

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 914 parts In-Stock

1+ parts

$0.248

100+ parts

-

1k+ parts

-

10k+ parts

$0.238

914

$0.248

-

-

$0.238

Northwest PG Solutions

USA . 931 parts In-Stock

1+ parts

$0.272

100+ parts

-

1k+ parts

-

10k+ parts

$0.240

931

$0.272

-

-

$0.240

IDEA Electronic Components Group

UK . 1,038 parts In-Stock

1+ parts

$14.505

100+ parts

-

1k+ parts

$13.054

10k+ parts

-

1,038

$14.505

-

$13.054

-

MKK Technologies

India . 1,250 parts In-Stock

1+ parts

$27.275

100+ parts

-

1k+ parts

-

10k+ parts

-

1,250

$27.275

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-

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DigiPath Technology Company

USA . 1,250 parts In-Stock

1+ parts

$27.275

100+ parts

-

1k+ parts

-

10k+ parts

-

1,250

$27.275

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-

-

Corphita

USA . 3,515 parts In-Stock

1+ parts

-

100+ parts

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3,515

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Parana Technologies

USA . 2,138 parts In-Stock

1+ parts

-

100+ parts

$17.343

1k+ parts

-

10k+ parts

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2,138

-

$17.343

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Overview

Elevate your telecommunications experience with the CR14-MQ/XXX by STMicroelectronics. Crafted with precision and expertise, this cutting-edge product exemplifies top-notch quality and reliability. Ideal for various applications in the telecom industry, this Telecom Interface IC ensures seamless connectivity and efficient performance. Trust in STMicroelectronics to deliver exceptional value and unmatched benefits with the CR14-MQ/XXX, providing customers with a competitive edge in their endeavors. Experience innovation at its finest with this superior product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the IC, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost in production.

Package Shape: RECTANGULAR

The rectangular package shape is common and versatile, making it compatible with a wide range of PCB layouts.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and functionality within the IC, enabling complex telecom interface operations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding environmental conditions, ensuring reliable performance.

Minimum Operating Temperature: -20 °C

The low minimum operating temperature allows for use in a wide range of environments, from freezing cold to hot temperatures.

Terminal Position: DUAL

The dual terminal position provides redundancy and improves signal integrity, leading to a more stable connection.

Maximum Seated Height: 1.75 mm

The low maximum seated height helps in accommodating the IC in slim and compact device designs.

Width: 3.9 mm

The narrow width of the IC enables it to fit into tight spaces on the PCB, making it versatile for various design constraints.

Length: 9.9 mm

The compact length of the IC contributes to space-saving on the PCB, especially in small form factor devices.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems, enhancing the overall performance of the IC.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring secure connections.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuit applications, this IC offers the necessary features and functionality for seamless telecommunications operations.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage is common in telecom systems, ensuring compatibility and ease of integration with existing circuits.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and reliable connections on the PCB, reducing the risk of signal interference or short circuits.

Technical Specifications

Other Function Telecom Interface ICs CR14-MQ/XXX attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

CR14-MQ/XXX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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