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ADN2820ACHIPS

Analog Devices

ADN2820ACHIPS by Analog Devices

Analog Devices' ADN2820ACHIPS is a 14-terminal telecom IC with 3.3V supply voltage, operating b/w -15 °C to 85°C. This bipolar technology chip is surface-mountable and uncased, suitable for telecom circuit applications requiring a compact rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,017 parts In-Stock

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Digiode

USA . 232 parts In-Stock

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Parana Technologies

USA . 92 parts In-Stock

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$10.566

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$9.826

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92

$10.566

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$9.826

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AZTECH Wire

Italy . 749 parts In-Stock

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$10.923

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$10.923

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IDEA Electronic Components Group

UK . 1,657 parts In-Stock

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$11.361

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$10.793

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$10.793

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$11.361

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$10.793

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DigiPath Technology Company

USA . 635 parts In-Stock

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$17.723

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$17.014

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$17.014

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$17.723

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$17.014

Native Components

USA . 326 parts In-Stock

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$23.062

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326

$23.062

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Northwest PG Solutions

USA . 935 parts In-Stock

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$25.368

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$22.831

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$25.368

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Component Stockers USA

USA . 755 parts In-Stock

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$99.990

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$99.990

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One Stop Electronics

USA . 1,555 parts In-Stock

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$258.000

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$258.000

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Semicontronic

India . 525 parts In-Stock

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$967.000

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$942.825

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$937.990

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525

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QUARKTWIN TECHNOLOGY LTD

USA . 12,497 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Corphita

USA . 699 parts In-Stock

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699

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Robosynatics

Brazil . 250 parts In-Stock

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250

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Lucentia Tech

USA . 250 parts In-Stock

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$13.360

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$12.371

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$12.371

250

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$12.371

A-Z Elektronik GmbH

Germany . 225 parts In-Stock

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Kepictronics

USA . 150 parts In-Stock

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Overview

Experience seamless communication with the ADN2820ACHIPS by Analog Devices, a top-tier manufacturer known for superior quality and innovation. This telecom interface IC offers unparalleled reliability and performance in various applications. With a power supply of 3.3V and a compact rectangular package, this chip provides value and convenience to customers looking for advanced telecom circuit solutions. Trust Analog Devices to deliver cutting-edge technology that enhances your connectivity experience.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used for telecom interface ICs, providing a standardized form factor for easy design-in.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes it compatible with many existing telecom systems and reduces the need for additional power conversion circuits.

No. of Terminals: 14

Having 14 terminals allows for versatile connectivity options and integration with various other components in the system.

Package Style (Meter): UNCASED CHIP

The uncased chip package style offers flexibility in mounting options and provides direct access to the silicon die for enhanced thermal performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this IC can withstand harsh environmental conditions and ensure reliable operation in demanding applications.

Minimum Operating Temperature: -15 °C

The low minimum operating temperature of -15 °C allows for operation in cold environments without compromising performance.

Terminal Position: UPPER

Having terminals positioned at the upper side simplifies PCB layout and routing of connections, making the integration process more efficient.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and low power consumption, making it suitable for telecom applications that require fast data processing.

Terminal Form: NO LEAD

No lead terminal form allows for direct surface mounting onto the PCB, enabling a compact footprint and reducing the risk of solder joint failures.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom applications, this IC offers optimized performance and functionality for use in communication systems.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and simplifies system design by using common voltage levels.

Technical Specifications

Other Function Telecom Interface ICs ADN2820ACHIPS attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XUUC-N14

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-15 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ADN2820ACHIPS Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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