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ADN2880ACHIPS

Analog Devices

ADN2880ACHIPS by Analog Devices

Analog Devices' ADN2880ACHIPS is a telecom IC with 17 terminals, operating at -40 to 95°C. It has a supply voltage of 3.3V and is designed for industrial applications. This surface-mount rectangular chip is ideal for telecom circuit interfaces.

Median Price

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Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,557 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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First Choice Components Inc.

USA . 545 parts In-Stock

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545

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VNN

France . 506 parts In-Stock

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Digiode

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Parana Technologies

USA . 4,579 parts In-Stock

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$12.506

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$11.630

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4,579

$12.506

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IDEA Electronic Components Group

UK . 1,913 parts In-Stock

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$13.447

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$12.775

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$12.775

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1,913

$13.447

$12.775

$12.775

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AZTECH Wire

Italy . 561 parts In-Stock

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$19.038

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$19.038

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DigiPath Technology Company

USA . 303 parts In-Stock

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$20.977

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$20.138

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$20.138

303

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$20.138

Semicontronic

India . 1,256 parts In-Stock

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$105.000

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$102.375

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$101.850

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Ampacity Inc.

Singapore . 606 parts In-Stock

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$421.000

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One Stop Electronics

USA . 1,619 parts In-Stock

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$633.000

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Continental Prestige Electronics

USA . 3,784 parts In-Stock

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Glotronic Ltd.

UK . 3,300 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,902 parts In-Stock

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Corphita

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Overview

Looking to enhance your telecom interface applications? Look no further than the ADN2880ACHIPS by Analog Devices! This high-quality IC offers a range of advantages, from its surface mount capability to its industrial temperature grade. With 17 terminals and a nominal supply voltage of 3.3V, this telecom circuit is sure to meet your needs. Trust Analog Devices for reliable performance and innovative solutions in the world of telecom interface ICs. Upgrade your applications today with the ADN2880ACHIPS!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for efficient and reliable PCB assembly, making the product suitable for mass production in a variety of telecommunications applications.

Package Shape: RECTANGULAR

The rectangular package shape helps in easy integration and placement on the PCB, optimizing space utilization and ensuring efficient design layout.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V ensures compatibility with a wide range of power sources commonly used in telecommunications devices, providing reliable and stable performance.

No. of Terminals: 17

Having 17 terminals allows for versatile connectivity options and supports multiple communication interfaces, enhancing the flexibility of the product in different applications.

Package Style (Meter): UNCASED CHIP

The unencased chip package style offers compact size and lightweight design, making it suitable for space-constrained applications while maintaining high performance and durability.

Maximum Operating Temperature: 95 °C

With a maximum operating temperature of 95°C, the product can withstand high temperature environments, ensuring reliable performance in challenging conditions.

Minimum Operating Temperature: -40 °C

The product's ability to operate at temperatures as low as -40°C enables use in harsh environments or outdoor applications, enhancing its durability and reliability.

Terminal Position: UPPER

The upper terminal position facilitates easy accessibility and soldering during PCB assembly, streamlining the manufacturing process and ensuring a secure connection.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, the product is built to withstand rugged conditions and maintain performance consistency in demanding environments, making it a reliable choice for telecom infrastructure.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead contamination and enhances reliability, making the product environmentally friendly and suitable for long-term deployment.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit IC type, the product is specifically designed to meet the stringent requirements of telecommunications systems, ensuring compatibility and high performance in telecom applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, the product offers energy efficiency and compatibility with standard power sources, making it an ideal choice for telecom devices with low power consumption requirements.

Technical Specifications

Other Function Telecom Interface ICs ADN2880ACHIPS attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XUUC-N17

No. of Functions:

1

No. of Terminals:

17

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ADN2880ACHIPS Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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