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ADN2830ACP-32-RL7

Analog Devices

ADN2830ACP-32-RL7 by Analog Devices

ADN2830ACP-32-RL7 by Analog Devices is a 32-terminal telecom IC with a nominal voltage of 5V. It operates in industrial temperature range (-40 to 85 °C) and features a square chip carrier package style. Ideal for telecom circuit applications, it has surface mount capability and thin profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,425 parts In-Stock

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7,425

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Digiode

USA . 184 parts In-Stock

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184

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Distributors (Availability)

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AZTECH Wire

Italy . 276 parts In-Stock

1+ parts

$6.661

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276

$6.661

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Parana Technologies

USA . 250 parts In-Stock

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$14.251

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$13.254

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250

$14.251

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$13.254

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IDEA Electronic Components Group

UK . 1,614 parts In-Stock

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$15.324

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$14.558

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$14.558

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1,614

$15.324

$14.558

$14.558

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DigiPath Technology Company

USA . 1,477 parts In-Stock

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$23.905

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$22.949

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$22.949

1,477

$23.905

$22.949

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$22.949

Native Components

USA . 702 parts In-Stock

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$24.330

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702

$24.330

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Northwest PG Solutions

USA . 537 parts In-Stock

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$26.763

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$24.087

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537

$26.763

$24.087

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Semicontronic

India . 440 parts In-Stock

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$264.000

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$257.400

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$256.080

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440

$264.000

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$256.080

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One Stop Electronics

USA . 588 parts In-Stock

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$863.000

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Corphita

USA . 967 parts In-Stock

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Overview

Unlock seamless communication possibilities with the ADN2830ACP-32-RL7 by Analog Devices. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Ideal for a wide range of applications in the telecom industry, this product boasts a sleek design and top-notch performance. Elevate your projects with ease and efficiency, thanks to the value and benefits that this cutting-edge technology brings to the table. Trust Analog Devices to deliver excellence every time.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto a printed circuit board, saving time and resources.

Package Shape: SQUARE

The square package shape provides a compact and efficient design, making it suitable for applications where space is limited.

No. of Terminals: 32

With 32 terminals, this product supports a wide range of connections and interfaces, offering versatility in functionality.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The chip carrier style with a very thin profile enables a compact and slim design, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging thermal conditions, increasing the product's durability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation even in extreme cold environments, enhancing the product's versatility.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good conductivity and solderability, ensuring secure and stable connections for the product.

Terminal Position: QUAD

The quad terminal position provides multiple connection points, facilitating easy integration and compatibility with various systems.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, the product has a low profile, making it suitable for applications with height constraints.

Width: 5 mm

The compact 5 mm width allows for efficient use of board space and enables the product to be easily integrated into tight layouts.

Length: 5 mm

The 5 mm length, combined with the square package shape, contributes to a space-saving design ideal for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the product can withstand harsh operating conditions typically encountered in industrial environments.

Terminal Form: NO LEAD

The no lead terminal form minimizes the risk of lead contamination and complies with environmental regulations, making it a more sustainable choice.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this product offers optimized performance and reliability in telecommunications systems.

Nominal Supply Voltage: 5 V

The 5 V nominal supply voltage is a common standard in many electronic systems, ensuring compatibility and ease of integration with existing setups.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, the product allows for dense packing of components on the circuit board, increasing functionality in a limited space.

Technical Specifications

Other Function Telecom Interface ICs ADN2830ACP-32-RL7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ADN2830ACP-32-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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