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ADN2830ACPZ32

Analog Devices

ADN2830ACPZ32 by Analog Devices

ADN2830ACPZ32 by Analog Devices is a 32-terminal telecom IC with a nominal voltage of 5V. It operates in industrial temperature range (-40 to 85 °C) and has a terminal pitch of 0.5mm. This square-shaped, surface-mount chip carrier is ideal for telecom circuit applications.

Median Price

$16.130

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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Rochester

USA . 33 parts In-Stock

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$16.130

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$14.430

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$13.580

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$13.580

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Chip Stock

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Vyrian

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Digiode

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Netsource Technology, Inc.

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Goldney Electronics S.L.

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ComSIT Distribution GmbH

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Ashlea Components Ltd

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Native Components

USA . 519 parts In-Stock

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$1.746

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$1.746

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Northwest PG Solutions

USA . 593 parts In-Stock

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$1.921

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AZTECH Wire

Italy . 370 parts In-Stock

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Parana Technologies

USA . 842 parts In-Stock

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$15.051

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$13.998

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IDEA Electronic Components Group

UK . 2,224 parts In-Stock

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$16.184

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$15.375

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$15.375

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DigiPath Technology Company

USA . 2,419 parts In-Stock

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$25.247

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$24.237

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Vigor

Singapore . 3,515 parts In-Stock

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Semicontronic

India . 1,527 parts In-Stock

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One Stop Electronics

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QUARKTWIN TECHNOLOGY LTD

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Glotronic Ltd.

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Metaverse IC Inc.

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Microchip USA

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Alle Elektronik GmbH

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RC Electronics

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S.R.D Solutions

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Corphita

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Overview

Elevate your telecom interface systems with the ADN2830ACPZ32 by Analog Devices. Known for their top-notch quality and cutting-edge technology, Analog Devices delivers industry-leading solutions in the category of Other Function Telecom Interface ICs. This surface mount chip carrier boasts a very thin profile design and matte tin finish, making it ideal for industrial applications. With a wide operating temperature range and nominal supply voltage of 5V, this telecom circuit IC offers unparalleled reliability and performance. Upgrade your systems today with the ADN2830ACPZ32 and experience the difference Analog Devices can make.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient automated assembly, reducing manufacturing time and cost.

Package Shape: SQUARE

Square package shape provides better stability and space utilization compared to other shapes.

No. of Terminals: 32

Sufficient number of terminals for connecting various components in a telecom interface IC.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of chip carrier, heat sink/slug, and very thin profile ensures effective heat dissipation and space-saving design.

Maximum Operating Temperature: 85 °C

Capable of operating efficiently at high temperatures, ensuring reliability in various environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for long-term performance.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections while maximizing space efficiency.

Maximum Seated Height: 1 mm

Low seated height helps in reducing the overall size of the IC and enhances compatibility with compact devices.

Width: 5 mm

Compact width of 5 mm makes it suitable for applications where space is limited.

Length: 5 mm

Square shape with a length of 5 mm offers a balanced design that fits well in various equipment layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh industrial environments.

Terminal Form: NO LEAD

No-lead terminal form complies with environmental regulations and offers improved signal integrity.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance and compatibility.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage simplifies integration with existing systems and power sources.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high-density packaging and precise connections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates low sensitivity to moisture, enhancing reliability during storage and handling.

Technical Specifications

Other Function Telecom Interface ICs ADN2830ACPZ32 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ADN2830ACPZ32 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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