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ADN2892ACPZ-RL

Analog Devices

ADN2892ACPZ-RL by Analog Devices

ADN2892ACPZ-RL by Analog Devices is a surface mount telecom IC with 1 function. It operates at a max temperature of 95°C and has a nominal voltage of 3.3V. It is suitable for industrial applications requiring a very thin profile and low power consumption.

Median Price

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Lifecycle Status

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1k+

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VNN

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 266 parts In-Stock

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$7.268

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Parana Technologies

USA . 996 parts In-Stock

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IDEA Electronic Components Group

UK . 442 parts In-Stock

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DigiPath Technology Company

USA . 446 parts In-Stock

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Semicontronic

India . 494 parts In-Stock

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Ampacity Inc.

Singapore . 617 parts In-Stock

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One Stop Electronics

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QUARKTWIN TECHNOLOGY LTD

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Continental Prestige Electronics

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Argo Parts USA

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Aranea Global

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Vigor

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Microchip USA

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Overview

Discover the ADN2892ACPZ-RL by Analog Devices, a high-quality telecom interface IC that offers unparalleled performance and reliability. As a trusted manufacturer in the industry, Analog Devices has designed this product to meet the needs of various applications. With its compact size and surface mount capability, it is perfect for space-constrained environments. The ADN2892ACPZ-RL operates at a nominal supply voltage of 3.3V and offers low power consumption, providing significant energy savings. Its advanced features and robust design make it an excellent choice for telecommunications circuits. Experience the value and benefits of this exceptional product, and elevate your connectivity solutions to new heights.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards, saving space and reducing manufacturing costs.

Package Shape: SQUARE

Square package shape offers good stability and easy handling during assembly processes.

Power Supplies (V): 3.3

Operates at a standard voltage of 3.3V, compatible with many systems and devices.

No. of Terminals: 16

Provides multiple connection points for enhanced functionality and versatility in telecommunications applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier and thin profile design allows for efficient heat dissipation and compact size, suitable for space-constrained environments.

Maximum Operating Temperature: 95 °C

Wide range of operating temperature ensures reliability and performance under various environmental conditions.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in diverse climates and locations.

Terminal Finish: MATTE TIN

Matte tin finish provides good electrical conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position allows for stable and secure connections, ensuring consistent performance.

Maximum Seated Height: 0.9 mm

Low seated height helps in minimizing overall height of the package, making it suitable for compact designs.

Width: 3 mm

Narrow width facilitates space-saving integration in electronic assemblies.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables robust soldering and rework processes.

Length: 3 mm

Short length contributes to a compact form factor, ideal for applications with limited space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Terminal Form: NO LEAD

No-lead terminal form complies with modern environmental regulations and offers improved solder joint reliability.

Maximum Supply Current: 0.054 mA

Low supply current requirement helps in conserving power and minimizing heat dissipation.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecommunications circuits, ensuring optimized performance and compatibility.

Nominal Supply Voltage: 3.3 V

Standard supply voltage of 3.3V simplifies power management and compatibility with other components.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high density mounting and precise connections in complex circuit layouts.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates good moisture resistance, ensuring reliability in humid or changing environmental conditions.

Technical Specifications

Other Function Telecom Interface ICs ADN2892ACPZ-RL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

ATM/SONET/SDH ICs

Maximum Supply Current:

.054 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

ADN2892ACPZ-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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