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ADN2830ACP32-REEL

Analog Devices

ADN2830ACP32-REEL by Analog Devices

ADN2830ACP32-REEL by Analog Devices is a 32-terminal telecom IC with a square package style. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 5V, it is designed for telecom circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,934 parts In-Stock

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Digiode

USA . 840 parts In-Stock

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840

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Nova Conductors

Japan . 91 parts In-Stock

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VNN

France . 76 parts In-Stock

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Aztec Data Supply Inc.

USA . 711 parts In-Stock

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$8.960

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711

$8.960

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Parana Technologies

USA . 2,360 parts In-Stock

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$12.106

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$11.258

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IDEA Electronic Components Group

UK . 1,714 parts In-Stock

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$13.017

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$12.366

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$12.366

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$12.366

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Corohmni

South Africa . 242 parts In-Stock

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$13.482

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AZTECH Wire

Italy . 757 parts In-Stock

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$13.544

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DigiPath Technology Company

USA . 1,270 parts In-Stock

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$20.307

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$19.494

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$19.494

1,270

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$19.494

Semicontronic

India . 1,119 parts In-Stock

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$53.000

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$51.675

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$51.410

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One Stop Electronics

USA . 286 parts In-Stock

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$273.000

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286

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Ampacity Inc.

Singapore . 266 parts In-Stock

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$766.000

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Continental Prestige Electronics

USA . 4,270 parts In-Stock

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Advanced Electronics

New Zealand . 1,728 parts In-Stock

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Argo Parts USA

USA . 671 parts In-Stock

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Bastille Electronics

Australia . 650 parts In-Stock

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650

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Corphita

USA . 122 parts In-Stock

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122

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Overview

Elevate your telecom interface capabilities with the ADN2830ACP32-REEL by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-notch quality and reliability in their products. This square-shaped chip carrier offers 32 terminals and operates efficiently in a wide temperature range. Perfect for industrial applications, this telecom circuit IC provides seamless connectivity and performance. Upgrade your systems with the ADN2830ACP32-REEL and experience the value and benefits it brings to your projects. Elevate your telecom interface capabilities with Analog Devices today!

Feature Benefit Bullets

Surface Mount: YES

Surface mountability allows for easy and efficient PCB assembly, saving time and effort in production.

Package Shape: SQUARE

Square package shape can provide better thermal characteristics and efficient use of PCB space.

No. of Terminals: 32

Having a higher number of terminals allows for more connectivity options and functionality in the telecom device.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers advanced thermal management capabilities in a compact form factor.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in extreme cold conditions without impacting performance.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and conductivity for secure connections.

Terminal Position: QUAD

Quad terminal position offers multiple connection points for enhanced signal routing and functionality.

Maximum Seated Height: 1 mm

Low maximum seated height helps in designing compact and slim telecom devices.

Width: 5 mm

Narrow width makes the product suitable for applications where space is a constraint.

Peak Reflow Temperature °C: 240

High peak reflow temperature ensures proper soldering and reliability during the assembly process.

Length: 5 mm

Compact length allows for efficient placement on the PCB while saving valuable board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Terminal Form: NO LEAD

No lead terminal form is environment-friendly and compliant with regulations, making the product sustainable.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC type provides optimized performance and functionality in telecom devices.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V makes it compatible with standard power sources, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and increased connectivity options.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product can withstand exposure to moderate levels of moisture during storage and handling.

Technical Specifications

Other Function Telecom Interface ICs ADN2830ACP32-REEL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e0

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

240

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ADN2830ACP32-REEL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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