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ADN2821XCHIP-10KWP

Analog Devices

ADN2821XCHIP-10KWP by Analog Devices

ADN2821XCHIP-10KWP by Analog Devices is a telecom IC with 17 terminals, operating at -40 to 95 °C. It has a supply voltage of 3.3V and is designed for industrial-grade applications. This surface-mount chip package is ideal for telecom circuit interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,857 parts In-Stock

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Digiode

USA . 437 parts In-Stock

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437

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Native Components

USA . 208 parts In-Stock

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$0.209

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$0.200

208

$0.209

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$0.200

Northwest PG Solutions

USA . 66 parts In-Stock

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$0.230

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$0.203

66

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Parana Technologies

USA . 155 parts In-Stock

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$6.757

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$6.284

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155

$6.757

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$6.284

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IDEA Electronic Components Group

UK . 1,325 parts In-Stock

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$7.266

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$6.903

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AZTECH Wire

Italy . 313 parts In-Stock

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$8.665

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DigiPath Technology Company

USA . 48 parts In-Stock

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$11.335

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$10.882

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$10.882

48

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$10.882

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$10.882

One Stop Electronics

USA . 147 parts In-Stock

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$55.000

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Semicontronic

India . 926 parts In-Stock

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$406.000

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$395.850

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$393.820

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926

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Corphita

USA . 777 parts In-Stock

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Overview

Elevate your telecom interface designs with the ADN2821XCHIP-10KWP by Analog Devices. Known for their superior quality and reliability, Analog Devices delivers innovative solutions that exceed expectations. This un cased chip offers a wide range of applications in the telecom industry, providing seamless integration and high performance. With a nominal supply voltage of 3.3V and industrial-grade temperature tolerance, this product ensures optimal functionality in any environment. Upgrade your projects today with the ADN2821XCHIP-10KWP and experience the unmatched value and benefits it brings to your designs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and quick assembly on PCBs, making this product suitable for high volume manufacturing.

Package Shape: RECTANGULAR

Rectangular package shape provides efficient use of board space and allows for easy integration into existing designs.

Power Supplies (V): 3.3

Operating at a voltage of 3.3V, this product is compatible with a wide range of systems and applications.

No. of Terminals: 17

Having 17 terminals allows for multiple connections and functionalities, making it versatile for various telecom interface applications.

Package Style (Meter): UNCASED CHIP

The unencased chip package style offers flexibility in mounting and integration options, catering to different design requirements.

Maximum Operating Temperature: 95 °C

With a maximum operating temperature of 95 °C, this product can withstand high temperature environments and ensure reliable performance.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C guarantees stable operation even in extreme cold conditions.

Terminal Position: UPPER

The upper terminal position simplifies board layout and routing, enhancing the overall ease of use and installation.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product can withstand harsh environmental conditions and ensure consistent performance in demanding settings.

Terminal Form: NO LEAD

The no-lead terminal form factor improves thermal performance and reliability, making this product suitable for telecom applications that require robust connectivity.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed as a telecom circuit interface IC, this product offers specialized functionality and features tailored for telecom systems and networks.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources and simplifies integration into existing telecom setups.

Technical Specifications

Other Function Telecom Interface ICs ADN2821XCHIP-10KWP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XUUC-N17

No. of Functions:

1

No. of Terminals:

17

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ADN2821XCHIP-10KWP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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