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ADN2820

Analog Devices

ADN2820 by Analog Devices

ADN2820 by Analog Devices is a 14-terminal telecom IC with 3.3V supply voltage, operating b/w -15 °C to 85°C. It features bipolar technology, tin-lead finish, and is surface mountable. Ideal for telecom circuits, this rectangular package chip serves as an interface in various applications.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,204 parts In-Stock

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Digiode

USA . 631 parts In-Stock

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631

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Distributors (Availability)

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AZTECH Wire

Italy . 513 parts In-Stock

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$14.237

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513

$14.237

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Parana Technologies

USA . 86 parts In-Stock

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$16.527

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$15.370

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86

$16.527

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$15.370

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IDEA Electronic Components Group

UK . 324 parts In-Stock

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$17.771

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$16.882

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$16.882

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324

$17.771

$16.882

$16.882

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DigiPath Technology Company

USA . 1,386 parts In-Stock

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$27.723

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$26.614

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$26.614

1,386

$27.723

$26.614

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$26.614

Ampacity Inc.

Singapore . 857 parts In-Stock

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$150.000

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857

$150.000

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One Stop Electronics

USA . 447 parts In-Stock

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$235.000

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447

$235.000

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Semicontronic

India . 183 parts In-Stock

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$522.000

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$508.950

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$506.340

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183

$522.000

$508.950

$506.340

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Corphita

USA . 632 parts In-Stock

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Northwest PG Solutions

USA . 423 parts In-Stock

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Native Components

USA . 162 parts In-Stock

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Overview

Experience seamless connectivity and exceptional performance with the Analog Devices ADN2820. Manufactured by industry leader Analog Devices, this telecom interface IC provides unparalleled quality and reliability. Ideal for a wide range of applications, this product is designed to meet the demands of today's fast-paced world. With its advanced technology and innovative design, the ADN2820 offers customers unmatched value, benefits, and advantages. Upgrade your telecommunications experience with the ADN2820 from Analog Devices.

Feature Benefit Bullets

Surface Mount: YES

Surface mount allows for easy and efficient assembly onto circuit boards, saving time and reducing manufacturing costs.

Package Shape: RECTANGULAR

Rectangular shape makes the product easy to handle and less prone to damage during installation.

Power Supplies (V): 3.3

Operating at 3.3V provides a suitable power supply for the device, ensuring stability and proper functioning.

No. of Terminals: 14

Having 14 terminals allows for multiple connection points, enabling versatile usage in telecom applications.

Package Style (Meter): UNCASED CHIP

Uncased chip design offers compactness and simplicity, ideal for space-constrained environments.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can withstand high temperature environments without compromising performance.

Minimum Operating Temperature: -15 °C

The ability to operate at -15 °C ensures functionality in colder conditions, making it suitable for various environments.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity, enhancing the reliability and longevity of the product.

Terminal Position: UPPER

Upper terminal position makes it easy to connect and integrate the product within a circuit, simplifying installation.

Technology: BIPOLAR

Bipolar technology ensures efficient signal processing and transmission, essential in telecom applications for reliable communication.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of short circuits and enhances the overall safety of the product.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, ensuring compatibility and optimal performance in telecom systems.

Nominal Supply Voltage: 3.3 V

Operates at a nominal supply voltage of 3.3V, meeting standard requirements for reliable operation in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ADN2820 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XUUC-N14

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-15 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

ADN2820 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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