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ADN2821ACHIPS-20K

Analog Devices

ADN2821ACHIPS-20K by Analog Devices

ADN2821ACHIPS-20K by Analog Devices is a telecom IC with 15 terminals, operating at -25 to 85 °C. It has a supply voltage of 3.3V and is surface mountable in a rectangular package shape. Ideal for telecom circuit applications due to its uncased chip package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,116 parts In-Stock

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Digiode

USA . 480 parts In-Stock

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480

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Distributors (Availability)

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Native Components

USA . 942 parts In-Stock

1+ parts

$0.145

100+ parts

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$0.139

942

$0.145

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$0.139

Northwest PG Solutions

USA . 1,096 parts In-Stock

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$0.159

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$0.141

1,096

$0.159

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$0.141

AZTECH Wire

Italy . 410 parts In-Stock

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$6.431

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410

$6.431

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Parana Technologies

USA . 188 parts In-Stock

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$15.027

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$13.975

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188

$15.027

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$13.975

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IDEA Electronic Components Group

UK . 627 parts In-Stock

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$16.158

100+ parts

$15.350

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$15.350

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627

$16.158

$15.350

$15.350

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DigiPath Technology Company

USA . 1,696 parts In-Stock

1+ parts

$25.206

100+ parts

$24.198

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$24.198

1,696

$25.206

$24.198

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$24.198

One Stop Electronics

USA . 807 parts In-Stock

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$318.000

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807

$318.000

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Ampacity Inc.

Singapore . 1,527 parts In-Stock

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$831.000

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1,527

$831.000

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Semicontronic

India . 135 parts In-Stock

1+ parts

$898.000

100+ parts

$875.550

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$871.060

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135

$898.000

$875.550

$871.060

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Corphita

USA . 533 parts In-Stock

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533

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Overview

Unlock a world of seamless communication with the ADN2821ACHIPS-20K by Analog Devices. Designed with precision and expertise, Analog Devices is a trusted name in the industry, known for delivering top-notch quality products. This versatile telecom interface IC offers countless applications, ensuring smooth and reliable connectivity. From its compact surface-mount design to its superior performance at various operating temperatures, this product is a game-changer. Experience the value and benefits of Analog Devices technology with the ADN2821ACHIPS-20K.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability enables easy and cost-effective assembly onto PCBs, making it suitable for mass production.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient space utilization and easier integration into electronic devices.

Power Supplies (V): 3.3

Operating at a power supply of 3.3V ensures compatibility with standard voltage levels in many electronic systems.

No. of Terminals: 15

Having 15 terminals provides flexibility for connecting to various components and interfaces within a telecom system.

Package Style (Meter): UNCASED CHIP

Uncased chip packaging simplifies the design process and reduces overall product size, ideal for compact devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the IC can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature of -25 °C ensures reliability even in cold environments, increasing the product's versatility.

Terminal Position: UPPER

Upper terminal position offers convenient access for connecting external components and streamlines the installation process.

Terminal Form: NO LEAD

No lead terminals contribute to a cleaner and more environmentally friendly manufacturing process, supporting sustainable practices.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC type ensures optimal performance and compatibility within telecommunications systems.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V helps maintain power efficiency and reliability in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs ADN2821ACHIPS-20K attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

R-XUUC-N15

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

DIE OR CHIP

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

ADN2821ACHIPS-20K Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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