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ADN2830ACP-32-RL

Analog Devices

ADN2830ACP-32-RL by Analog Devices

ADN2830ACP-32-RL by Analog Devices is a 32-terminal telecom IC with a nominal voltage of 5V. It operates in industrial temperature range (-40 to 85 °C) and features tin lead terminal finish. Suitable for telecom circuits, this square chip carrier has a very thin profile package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,546 parts In-Stock

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5,546

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Digiode

USA . 631 parts In-Stock

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631

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Distributors (Availability)

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Parana Technologies

USA . 1,724 parts In-Stock

1+ parts

$11.089

100+ parts

-

1k+ parts

$10.313

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1,724

$11.089

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$10.313

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IDEA Electronic Components Group

UK . 1,281 parts In-Stock

1+ parts

$11.924

100+ parts

$11.328

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$11.328

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1,281

$11.924

$11.328

$11.328

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Native Components

USA . 239 parts In-Stock

1+ parts

$13.070

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239

$13.070

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Northwest PG Solutions

USA . 544 parts In-Stock

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$14.377

100+ parts

$12.939

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544

$14.377

$12.939

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DigiPath Technology Company

USA . 1,659 parts In-Stock

1+ parts

$18.601

100+ parts

$17.857

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$17.857

1,659

$18.601

$17.857

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$17.857

AZTECH Wire

Italy . 219 parts In-Stock

1+ parts

$18.984

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219

$18.984

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One Stop Electronics

USA . 1,199 parts In-Stock

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$443.000

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1,199

$443.000

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Semicontronic

India . 1,104 parts In-Stock

1+ parts

$751.000

100+ parts

$732.225

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$728.470

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1,104

$751.000

$732.225

$728.470

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Corphita

USA . 13 parts In-Stock

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Overview

Unlock the power of seamless connectivity with the ADN2830ACP-32-RL by Analog Devices. Renowned for their top-notch quality and reliability, Analog Devices delivers cutting-edge telecom interface ICs that set the standard in the industry. This square chip carrier offers a very thin profile and 32 terminals, making it perfect for a wide range of applications. From telecommunications to networking, this industrial-grade IC provides unmatched performance and functionality. Experience the value and benefits of Analog Devices' innovative technology with the ADN2830ACP-32-RL. Elevate your projects to new heights with this game-changing product.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Package Shape: SQUARE

Provides a compact and symmetrical design, making it easy to fit into tight spaces on a PCB.

No. of Terminals: 32

Offers a sufficient number of terminals for connecting various components and devices in a telecom system.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Enables a slim and space-saving design for applications where board space is limited.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even under extended periods of high temperature conditions.

Minimum Operating Temperature: -40 °C

Can operate effectively in harsh environments with low temperatures, providing versatility in application.

Terminal Finish: TIN LEAD

Ensures good conductivity and solderability for secure connections within the circuit.

Terminal Position: QUAD

Facilitates easy soldering and connection of the IC to the PCB, enhancing the overall reliability of the assembly.

Maximum Seated Height: 1 mm

Allows for a low-profile installation, ideal for compact electronic devices.

Width: 5 mm

Compact width dimension facilitates easy integration into various system layouts.

Length: 5 mm

Compact length dimension offers flexibility in the placement of the IC on the PCB.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications that require robust performance and reliability in harsh operating conditions.

Terminal Form: NO LEAD

Lead-free terminal form ensures compliance with environmental regulations and RoHS standards.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance and compatibility with telecom systems.

Nominal Supply Voltage: 5 V

Compatible with standard voltage levels, making it easy to integrate into existing systems and designs.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density packaging of components, maximizing board space utilization.

Technical Specifications

Other Function Telecom Interface ICs ADN2830ACP-32-RL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e0

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

ADN2830ACP-32-RL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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