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RN4020BCN-V/RM120

Microchip Technology

RN4020BCN-V/RM120 by Microchip Technology

RN4020BCN-V/RM120 by Microchip Technology is a telecom IC with 24 terminals, operating at -30 to 85°C. It has a data rate of 1 Mbps and operates at 3.3V supply voltage. This surface-mount IC is ideal for telecom circuit applications due to its TS16949 screening level and compact rectangular package design.

Median Price

$11.610

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 420 parts In-Stock

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$11.540

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$10.540

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$10.440

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420

$11.540

$10.540

$10.440

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DigiKey

USA . 82 parts In-Stock

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$11.610

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$10.444

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82

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Microchip Technology

USA . 47 parts In-Stock

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$11.610

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$10.000

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47

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Vyrian

USA . 5,308 parts In-Stock

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Inventory MP

USA . 68 parts In-Stock

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68

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Bristol Electronics

USA . 68 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 157 parts In-Stock

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$9.870

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Component Stockers USA

USA . 1,053 parts In-Stock

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$11.380

100+ parts

$9.800

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1,053

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$9.800

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Corohmni

South Africa . 71 parts In-Stock

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$11.803

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AZTECH Wire

Italy . 564 parts In-Stock

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$12.078

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Aztec Data Supply Inc.

USA . 1,762 parts In-Stock

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$17.118

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Argo Parts USA

USA . 2,352 parts In-Stock

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RGB Technical Solutions

Ukraine . 1,979 parts In-Stock

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Continental Prestige Electronics

USA . 406 parts In-Stock

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Aranea Global

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Perfect Parts

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Overview

Discover the cutting-edge RN4020BCN-V/RM120 by Microchip Technology, a top-tier manufacturer renowned for its quality and innovation. This versatile telecom interface IC boasts a wide range of applications with superior performance and reliability. With a nominal supply voltage of 3.3V and a data rate of 1 Mbps, this product offers unmatched value and benefits to customers seeking high-quality solutions for their electronic projects. Upgrade your designs with the RN4020BCN-V/RM120 and experience the advantage of Microchip Technology's exceptional craftsmanship.

Feature Benefit Bullets

Surface Mount: YES

This product is easy to install and saves space on the PCB.

Screening Level: TS 16949

This product meets high-quality standards, ensuring reliability and performance.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into existing designs.

No. of Terminals: 24

With 24 terminals, this product offers versatility in connectivity options.

Package Style (Meter): MICROELECTRONIC ASSEMBLY

The microelectronic assembly package style provides durability and protection for the IC.

Maximum Operating Temperature: 85 °C

This product can operate efficiently in high-temperature environments.

Minimum Operating Temperature: -30 °C

The wide range of operating temperatures allows for use in various conditions.

Terminal Finish: GOLD OVER NICKEL

The gold-over-nickel terminal finish ensures long-term durability and connectivity.

Maximum Seated Height: 2.38 mm

The low seated height of 2.38 mm saves space and allows for compact designs.

Width: 11.5 mm

The 11.5 mm width of the product makes it suitable for applications with limited space.

Length: 19.5 mm

The 19.5 mm length provides ample space for integration while keeping the size compact.

Terminal Form: NO LEAD

The no-lead terminal form reduces environmental impact and is RoHS compliant.

Telecom IC Type: TELECOM CIRCUIT

This telecom circuit IC is specifically designed for telecom applications, ensuring optimal performance.

Nominal Supply Voltage: 3.3 V

The 3.3 V supply voltage is common in many applications, making integration easier.

Terminal Pitch: 1.2 mm

The 1.2 mm terminal pitch allows for precise connections and reduces the risk of short circuits.

Data Rate: 1 Mbps

The high data rate of 1 Mbps enables fast and reliable communication in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs RN4020BCN-V/RM120 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-XXMA-N24

JESD-609 Code:

e4

Length:

19.5 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

XMA

Package Equivalence Code:

MODULE,24LEAD(UNSPEC)

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Screening Level:

TS 16949

Maximum Seated Height:

2.38 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

GOLD OVER NICKEL

Terminal Form:

Terminal Pitch:

1.2 mm

Terminal Position:

UNSPECIFIED

Width:

11.5 mm

Trade Compliance

RN4020BCN-V/RM120 Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8529.90.22.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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