Loading...

OL2381AHN/C0B,515

NXP Semiconductors

OL2381AHN/C0B,515 by NXP Semiconductors

OL2381AHN/C0B,515 by NXP Semiconductors is a telecom interface IC with 32 terminals in a square chip carrier package. Operating at 2.7V, it has a temperature range of -25 to 85°C and low supply current of 0.0012mA. Ideal for telecom circuits, this IC is surface mountable and features a very thin profile for compact applications.

Median Price

$3.130

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 996 parts In-Stock

1+ parts

$5.210

100+ parts

$3.933

1k+ parts

$3.590

10k+ parts

$3.260

996

$5.210

$3.933

$3.590

$3.260

Rochester

USA . 2,293 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

2,293

-

$3.130

$2.800

$2.630

Verical

USA . 1,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.025

10k+ parts

$2.850

1,297

-

-

$3.025

$2.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$3.210

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$3.210

-

-

-

Digiode

USA . 251 parts In-Stock

1+ parts

$6.032

100+ parts

-

1k+ parts

-

10k+ parts

-

251

$6.032

-

-

-

Vyrian

USA . 6,701 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,701

-

-

-

-

Flip Electronics

USA . 1,297 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,297

-

-

-

-

Anansix

USA . 366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

366

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 646 parts In-Stock

1+ parts

$5.400

100+ parts

-

1k+ parts

-

10k+ parts

-

646

$5.400

-

-

-

Corphita

USA . 676 parts In-Stock

1+ parts

$5.715

100+ parts

-

1k+ parts

-

10k+ parts

-

676

$5.715

-

-

-

AZTECH Wire

Italy . 756 parts In-Stock

1+ parts

$17.826

100+ parts

-

1k+ parts

-

10k+ parts

-

756

$17.826

-

-

-

UNI Independent Distributors

Spain . 6,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,223

-

-

-

-

Overview

Unlock seamless communication with the OL2381AHN/C0B,515 by NXP Semiconductors. This telecom interface IC boasts top-notch quality and reliability from a trusted manufacturer. Ideal for various applications in the telecommunications industry, this product offers unparalleled value with its cutting-edge technology. Experience improved efficiency and performance with this innovative solution that is sure to exceed your expectations. Elevate your communication systems with the OL2381AHN/C0B,515 today!

Feature Benefit Bullets

Package Body Material : PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC.

Surface Mount : YES

Allows for easy and efficient assembly onto circuit boards.

Package Shape : SQUARE

Provides a compact and space-saving design for the IC.

Power Supplies (V) : 2.7

Optimal power supply voltage for the IC to function efficiently.

No. of Terminals : 32

Offers a high number of terminals for connectivity and functionality.

Package Style (Meter) : CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of package styles allows for versatility and efficient heat dissipation.

Maximum Operating Temperature : 85 °C

Ensures reliable performance even under high temperature conditions.

Minimum Operating Temperature : -25 °C

Can operate effectively in cold temperature environments.

Terminal Position : QUAD

Organized terminal layout for easy integration into circuits.

Maximum Seated Height : 0.85 mm

Low profile design for compact installations.

Width : 5 mm

Compact width for fitting into tight spaces.

Peak Reflow Temperature °C : 260

High peak reflow temperature capability for efficient soldering during assembly.

Length : 5 mm

Compact length for efficient use of space on circuit boards.

Terminal Form : NO LEAD

Lead-free terminal form for environmental consideration and regulatory compliance.

Maximum Supply Current : 0.0012 mA

Low supply current consumption for reduced power usage.

Telecom IC Type : TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance.

Nominal Supply Voltage : 2.7 V

Matches the power supply voltage for consistent and stable operation.

Terminal Pitch : 0.5 mm

Fine terminal pitch for high-density integration on circuit boards.

Moisture Sensitivity Level (MSL) : 2A

Moderate moisture sensitivity level for handling and storage considerations.

Technical Specifications

Other Function Telecom Interface ICs OL2381AHN/C0B,515 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.7

Qualification:

Not Qualified

Maximum Seated Height:

.85 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.0012 mA

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

OL2381AHN/C0B,515 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 17