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OL2381AHN

NXP Semiconductors

OL2381AHN by NXP Semiconductors

OL2381AHN by NXP Semiconductors is a telecom interface IC designed for reliable performance in various applications. It features a compact 5x5 mm square package, operates b/w -25 °C to 85 °C, and supports a nominal voltage of 2.7V. Ideal for surface mount designs, it ensures efficient connectivity in telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,348 parts In-Stock

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2,348

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Flip Electronics

USA . 1,297 parts In-Stock

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1,297

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Anansix

USA . 1,099 parts In-Stock

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1,099

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Vyrian

USA . 186 parts In-Stock

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186

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One Stop Electronics

USA . 726 parts In-Stock

1+ parts

$138.000

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726

$138.000

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A-Z Elektronik GmbH

Germany . 8,169 parts In-Stock

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UNI Independent Distributors

Spain . 7,645 parts In-Stock

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Corphita

USA . 1,822 parts In-Stock

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Overview

Elevate your telecom solutions with the OL2381AHN from NXP Semiconductors, a leader in innovative technology. Designed for reliability and efficiency, this high-quality interface IC excels in various applications, ensuring seamless communication in demanding environments. With robust thermal performance and a compact design, it offers exceptional value and adaptability, empowering customers to achieve their goals effortlessly while minimizing operational risks. Choose NXP for unmatched quality and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, maximizing space on the PCB and facilitating automated assembly.

Package Shape: SQUARE

A square package shape provides uniform thermal distribution and ease of integration into circuit layouts.

No. of Terminals: 32

With 32 terminals, this IC offers flexibility in design and connectivity to multiple components, enhancing functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

This style allows for effective heat dissipation, making the IC reliable for high-performance applications.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures the IC can function reliably in diverse environments.

Minimum Operating Temperature: -25 °C

A lower operating temperature of -25 °C allows for use in harsh conditions, appealing to a broader range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium gold finish enhances conductivity and corrosion resistance, ensuring long-term reliability and performance.

Terminal Position: QUAD

Quad terminal positioning facilitates easier routing on PCBs, optimizing circuit layouts for better performance.

Width: 5 mm

A compact width of 5 mm allows for high-density designs, making it suitable for space-constrained applications.

Length: 5 mm

The short length complements the width, ensuring a compact form factor that integrates easily into various systems.

Terminal Form: NO LEAD

No lead terminals reduce the overall footprint and allow for easier placement on dense circuit boards.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecommunications applications ensures optimized performance for signal processing and transmission.

Nominal Supply Voltage: 2.7 V

A low nominal supply voltage of 2.7V enhances energy efficiency and is compatible with battery-operated devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5mm allows for high-density configurations, making it suitable for modern, compact electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, suggesting the need for proper handling but still suitable for a variety of assembly processes.

Technical Specifications

Other Function Telecom Interface ICs OL2381AHN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

OL2381AHN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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