Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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OL2381AHN by NXP Semiconductors is a telecom interface IC designed for reliable performance in various applications. It features a compact 5x5 mm square package, operates b/w -25 °C to 85 °C, and supports a nominal voltage of 2.7V. Ideal for surface mount designs, it ensures efficient connectivity in telecom systems.
Median Price
-
Lifecycle Status
Suppliers In-Stock
4
In-Stock Inventory
1k+
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Flip Electronics
Anansix
Vyrian
One Stop Electronics
$138.000
A-Z Elektronik GmbH
UNI Independent Distributors
Corphita
The use of plastic/epoxy material ensures durability and protection against environmental factors, making it suitable for various applications.
Surface mount technology allows for a compact design, maximizing space on the PCB and facilitating automated assembly.
A square package shape provides uniform thermal distribution and ease of integration into circuit layouts.
With 32 terminals, this IC offers flexibility in design and connectivity to multiple components, enhancing functionality.
This style allows for effective heat dissipation, making the IC reliable for high-performance applications.
An operating temperature of up to 85 °C ensures the IC can function reliably in diverse environments.
A lower operating temperature of -25 °C allows for use in harsh conditions, appealing to a broader range of applications.
The nickel-palladium gold finish enhances conductivity and corrosion resistance, ensuring long-term reliability and performance.
Quad terminal positioning facilitates easier routing on PCBs, optimizing circuit layouts for better performance.
A compact width of 5 mm allows for high-density designs, making it suitable for space-constrained applications.
The short length complements the width, ensuring a compact form factor that integrates easily into various systems.
No lead terminals reduce the overall footprint and allow for easier placement on dense circuit boards.
Being specifically designed for telecommunications applications ensures optimized performance for signal processing and transmission.
A low nominal supply voltage of 2.7V enhances energy efficiency and is compatible with battery-operated devices.
A terminal pitch of 0.5mm allows for high-density configurations, making it suitable for modern, compact electronic designs.
MSL level 3 indicates moderate moisture sensitivity, suggesting the need for proper handling but still suitable for a variety of assembly processes.
Other Function Telecom Interface ICs OL2381AHN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
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No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
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Surface Mount:
Telecom IC Type:
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OL2381AHN Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N7002
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
1N4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
2N2222A
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
LL4148
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Itt Semiconductor
BSS138
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
Taiwan Semiconductor
General Diode
1N4148WS
General Instrument
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
RN42XVP-I/RM
Microchip Technology
RN42XVP-I/RM by Microchip Technology is a telecom IC with 20 terminals, operating temperature range of -40 to 85 °C. It has a data rate of 0.3 Mbps and operates at a nominal voltage of 3.3 V. This rectangular package is ideal for industrial applications requiring reliable telecom circuit connectivity.
BLED112-V1
Silicon Labs
BLED112-V1 by Silicon Labs is a RECTANGULAR MICROELECTRONIC ASSEMBLY with an operating temperature range of -40 to 85°C. It is an INDUSTRIAL-grade TELECOM CIRCUIT suitable for various telecom interface applications.
XB3-24AUT-J
Digi International
XB3-24AUT-J by Digi International is a TELECOM CIRCUIT with 1 Mbps Data Rate. Operating Temperature ranges from -40 to 85 °C. It is used in telecom interfaces for various applications due to its RECTANGULAR package shape and SPECIAL SHAPE style.
MRF24J40MAT-I/RM
MRF24J40MAT-I/RM by Microchip: Telecom IC with 3.3V supply, 12 terminals, -40 to 85°C temp range. Ideal for industrial applications requiring reliable wireless communication in a compact MICROELECTRONIC ASSEMBLY package.
EYSHSNZWZ
Kaga Electronics
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 28; Package Shape: RECTANGULAR; JESD-30 Code: R-XBGA-N28; Minimum Operating Temperature: -40 Cel;
RN42N-I/RM
RN42N-I/RM by Microchip Technology is a telecom IC with 35 terminals, operating temperature range of -40 to 85°C, and data rate of 3 Mbps. It is a surface mount device suitable for industrial applications requiring a nominal voltage of 3.3V.
ST25R3914-AQWT
STMicroelectronics
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
ESP32-WROVER-E
Espressif Systems (shanghai)
ESP32-WROVER-E by Espressif Systems is a telecom IC with 150 Mbps data rate, operating at -40 to 85°C. With 3.3V supply voltage, it's ideal for industrial applications requiring high-speed wireless connectivity in compact form factor (31.4mm x 18mm).
LTC5596IDC#TRMPBF
Analog Devices
LTC5596IDC#TRMPBF by Analog Devices is a Telecom IC with 8 terminals, matte tin finish, and 3.3V supply voltage. It is a small outline package suitable for telecom circuit applications requiring a compact design with a 0.5mm terminal pitch.
MAX-M8Q-0-10
U-blox Ag
MAX-M8Q-0-10 by U-blox Ag is an AEC-Q100 certified GNSS Module with 18 terminals, operating from -40 to 85°C. Its compact MICROELECTRONIC ASSEMBLY package makes it ideal for industrial applications requiring precise location tracking in harsh environments.
BQ51003YFPR
Texas Instruments
BQ51003YFPR by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w -40 to 85°C, with a battery supply of 5V. With a very thin profile and fine pitch, it's ideal for industrial telecom circuits requiring precise power management.
CY7B933-JXC
Infineon Technologies
Infineon Technologies' CY7B933-JXC is a BICMOS technology telecom IC with 28 terminals in a square chip carrier package. Operating at 5V, it supports data rates up to 400 Mbps and draws a max supply current of 155mA. Ideal for telecom circuits, this IC has a temperature range of 0-70°C and is surface mountable.
BGM121A256V2R
BGM121A256V2R by Silicon Labs is a surface mount telecom interface IC with 1 function. It has a square package shape, 56 terminals, and a max seated height of 1.4mm. This industrial-grade IC operates at temperatures ranging from -40 to 85°C and has a nominal voltage of 3.3V.
SA602AN
Philips Components
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIP; Terminal Pitch: 2.54 mm; Minimum Operating Temperature: -40 Cel; Maximum Seated Height: 4.2 mm;
450-0064
Ls Research
LS Research 450-0064 is a telecom IC with 52 terminals in a rectangular microelectronic assembly. Operating at -40 to 85°C, it has a nominal voltage of 3.6V and terminal pitch of 1mm. Ideal for telecom interface applications due to its industrial temperature grade and no lead terminal form.
PD69208T4ILQ-TR
Microchip Technology's PD69208T4ILQ-TR is a 56-terminal telecom IC with a max operating temp of 85°C. It features a no-lead terminal form, quad terminal position, and industrial temperature grade. Ideal for telecom circuits, this chip carrier package has a square shape and very thin profile for surface mount applications.
STID135-WB
MRF24WG0MB-I/RM
MRF24WG0MB-I/RM by Microchip: Operates at -40 to 85°C, with 3.3V supply voltage. Telecom IC for industrial use, featuring 36 terminals in a rectangular package style. Ideal for applications requiring reliable telecom interface ICs.
MAX-8Q-0
MAX-8Q-0 by U-blox Ag is an AEC-Q100 graded telecom IC with 18 terminals, operating b/w -40 to 85°C. With a nominal voltage of 3V, it is ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY package style. The IC's DUAL terminal position and NO LEAD form make it suitable for telecom circuit designs needing high reliability in harsh environments.
CC2564CRVMR
CC2564CRVMR by Texas Instruments is a telecom IC with 76 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a data rate of 4 Mbps and nominal voltage of 3.6V. Ideal for telecom circuits, it has a very thin profile and matte tin terminal finish.
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OL2300NHN
NXP Semiconductors
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: VQCCN; Package Shape: SQUARE;
OL2300NHN/F,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
OL2311AHN
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
OL2311AHN/C0B,515
OL2381AHN/C0B,515
OL2381AHN/C0CZ
OL2385AHN/00100
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
OL2385AHN/00100Y
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
OL2385AHN/001A0
OL2385AHN/001A0Y
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
OL2385AHN/001A1
TELECOM CIRCUIT;
OL2385AHN/001A1Y
OL2385AHN/001A2
OL2385AHN/001B0
OL2385AHN/001B0Y
OL2385AHN/001C0
OL2385AHN/001C0Y
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