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OL2300NHN

NXP Semiconductors

OL2300NHN by NXP Semiconductors

OL2300NHN by NXP Semiconductors is a telecom interface IC designed for surface mount applications. It features a compact 3mm x 3mm size, operates b/w -25 °C to 85 °C, and supports a nominal voltage of 2.7V. Ideal for thin-profile telecom circuits, it enhances connectivity in various devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,621 parts In-Stock

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4,621

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Vyrian

USA . 1,562 parts In-Stock

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1,562

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Anansix

USA . 106 parts In-Stock

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106

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One Stop Electronics

USA . 705 parts In-Stock

1+ parts

$976.000

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705

$976.000

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Kepictronics

USA . 5,155 parts In-Stock

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5,155

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Corphita

USA . 4,970 parts In-Stock

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4,970

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UNI Independent Distributors

Spain . 2,288 parts In-Stock

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2,288

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Overview

Unlock unparalleled performance with the OL2300NHN from NXP Semiconductors, a leader in innovative telecom solutions. This compact, high-quality interface IC offers exceptional reliability and versatility, making it ideal for various applications in modern communication systems. With its robust design and superior temperature resilience, it ensures seamless connectivity while maximizing efficiency and minimizing space. Transform your projects with NXP’s commitment to excellence and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to moisture and environmental factors, making this product suitable for various telecom applications.

Surface Mount: YES

Being a surface mount device allows for a compact design and easy integration into modern circuit boards, enhancing overall assembly efficiency.

Package Shape: SQUARE

The square shape provides efficient space utilization on the PCB, allowing for denser layouts and improved performance in space-constrained applications.

No. of Terminals: 16

With 16 terminals, this IC offers sufficient connectivity options for versatile applications while maintaining a compact footprint.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile of the chip carrier package enhances its suitability for slim electronic devices, catering to the trend of miniaturization in telecom products.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in a wide range of environments, from typical office settings to industrial applications.

Minimum Operating Temperature: -25 °C

With a minimum operating temperature of -25 °C, this IC is capable of functioning in extreme cold conditions, making it ideal for outdoor and harsh environments.

Terminal Position: QUAD

The quad terminal positioning supports efficient routing on PCBs, simplifying design processes and improving signal integrity.

Maximum Seated Height: 1 mm

A maximum seated height of just 1 mm helps in creating ultra-low-profile devices, catering to applications requiring minimal space.

Width: 3 mm

With a width of 3 mm, this IC is suitable for compact designs, allowing for greater flexibility in product dimensions.

Length: 3 mm

A 3 mm length further enhances its compactness, making it easy to fit into space-constrained designs.

Terminal Form: NO LEAD

The no lead terminal form design helps in reducing manufacturing costs and improving soldering performance, making it an efficient choice for manufacturers.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, it is specifically designed for telecommunications applications, ensuring optimized functionality for communication systems.

Nominal Supply Voltage: 2.7 V

A nominal supply voltage of 2.7 V allows for low power consumption, which is critical for battery-operated devices and energy-efficient designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm enables high-density packaging, accommodating more functions in a smaller area, ideal for modern electronic systems.

Technical Specifications

Other Function Telecom Interface ICs OL2300NHN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N16

Length:

3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

OL2300NHN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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