Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BGS15AN16E6327XTSA1
Infineon Technologies
BGS15AN16E6327XTSA1 by Infineon is a telecom interface IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -30 to 85°C, with a nominal voltage of 3.5V. This IC is designed for telecom circuits, featuring a very thin profile and tin terminal finish for surface mount applications.
S-PQCC-N16
e3
2.3 mm
1
16
85 Cel
-30 Cel
PLASTIC/EPOXY
HVQCCN
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
.77 mm
3.5 V
YES
TELECOM CIRCUIT
OTHER
TIN
NO LEAD
.5 mm
QUAD
BGS12AL74E6327XTSA1
Infineon's BGS12AL74E6327XTSA1 is a telecom IC with 6 terminals in a rectangular chip carrier package. Operating b/w -30°C to 85°C, it has a nominal voltage of 2.8V. Ideal for telecom interfaces, this surface-mount IC features gold terminal finish and 0.55mm pitch.
R-XBCC-B6
e4
6
UNSPECIFIED
BCC
RECTANGULAR
CHIP CARRIER
2.8 V
GOLD
BUTT
.55 mm
BOTTOM
1.5 mm
BGS12AL76E6327XTMA1
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
1.26 mm
.4 mm
.48 mm
1.4 mm
RI-STU-MRD1-30
Texas Instruments
RI-STU-MRD1-30 by Texas Instruments is a 30-terminal RECTANGULAR package MICROELECTRONIC ASSEMBLY with -20 to 50 °C operating temp range. It features DUAL terminals, TELECOM CIRCUIT type, and 5V supply voltage. Ideal for telecom interface applications requiring reliable performance in various temperature conditions.
R-XDMA-T30
30
50 Cel
-20 Cel
MICROELECTRONIC ASSEMBLY
5 V
NO
THROUGH-HOLE
DUAL
BA4116FV-E2
ROHM
ROHM's BA4116FV-E2 is a 16-terminal telecom interface IC with a small outline, thin profile package. It operates b/w -30°C to 85°C and has a peak reflow temperature of 260°C. Ideal for telecom circuits, it has a nominal voltage of 5V and Gull Wing terminal form.
R-PDSO-G16
e3/e2
5 mm
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
260
Not Qualified
1.2 mm
TIN/TIN COPPER
GULL WING
.65 mm
10
4.4 mm
L3845B
STMicroelectronics
L3845B by STMicroelectronics is a telecom interface IC designed for robust applications. It operates within a voltage range of 20V and withstands temperatures from -40 °C to 70°C. With an 8-terminal, through-hole design, it ensures reliable performance in various telecom circuits.
R-PDIP-T8
8
70 Cel
-40 Cel
DIP
DIP8,.3
IN-LINE
20
5.08 mm
Analog Transmission Interfaces
20 V
MATTE TIN
2.54 mm
7.62 mm
L3845D1013TR
STMicroelectronics L3845D1013TR is a telecom interface IC with 8 terminals in a small outline package. It operates b/w -40 °C to 70°C, suitable for telecom circuits. The package is made of plastic/epoxy, surface mountable, and has a gull wing terminal form.
R-PDSO-G8
e0
4.9 mm
SOP
SMALL OUTLINE
1.75 mm
TIN LEAD
1.27 mm
3.9 mm
LM3290TME/NOPB
LM3290TME/NOPB by Texas Instruments is a 30-terminal GRID ARRAY IC with TIN SILVER COPPER finish. It operates b/w -30 to 85 °C, with peak reflow temp of 260C for telecom circuits. Its 0.4mm pitch and 0.675mm height make it suitable for compact telecom interface applications.
R-XBGA-B30
e1
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.675 mm
TIN SILVER COPPER
BALL
LM3290TMX/NOPB
LM3290TMX/NOPB by Texas Instruments is a telecom IC with 30 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30 seconds. With a very thin profile and fine pitch, it's ideal for telecom circuit applications.
LM3291TME/NOPB
LM3291TME/NOPB by Texas Instruments is a 12-terminal IC with a rectangular package style. It operates b/w -30 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for telecom circuits due to its thin profile and fine pitch grid array package design.
R-XBGA-B12
12
LM3291TMX/NOPB
LM3291TMX/NOPB by Texas Instruments is a telecom interface IC with 12 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30s. This very thin profile IC is ideal for telecom circuit applications due to its fine pitch and ball terminal form.
P5DF081HN/T1AD2060
NXP Semiconductors
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HQCCN; Package Shape: SQUARE;
S-PQCC-N32
32
-25 Cel
HQCCN
CHIP CARRIER, HEAT SINK/SLUG
3 V
NICKEL PALLADIUM GOLD
AMIS49587C5871RG
Onsemi
AMIS49587C5871RG by Onsemi is a 28-terminal telecom IC with 3.3V supply, operating from -40 to 80 °C. It features matte tin finish, J bend terminals, and quad position for telecom circuit applications in a square chip carrier package measuring 11.506mm x 11.506mm x 4.572mm.
S-PQCC-J28
11.506 mm
3
28
80 Cel
QCCJ
LDCC28,.5SQ
3.3
4.572 mm
Modems
.08 mA
3.3 V
Matte Tin (Sn) - annealed
J BEND
PCM3060PW
PCM3060PW by Texas Instruments is a 2-channel CMOS Telecom IC with 3.3V supply voltage. It comes in a small outline, thin profile package with 28 terminals and operates b/w -25 to 85°C. Ideal for telecom circuits, it features nickel palladium gold terminal finish and gull wing form factor for surface mount applications.
R-PDSO-G28
9.7 mm
2
CMOS
STPAC01F2
STPAC01F2 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It features an operating temp range of -30 °C to 85°C, a nominal voltage of 2.7V, and an ultra-thin profile with 8 terminals. Ideal for compact telecom devices, it ensures reliable performance in various environments.
S-PBGA-B8
1.57 mm
.715 mm
2.7 V
SN65LVPE502RGET
SN65LVPE502RGET by Texas Instruments is a telecom interface IC with 2 functions, operating at 3.3V. It features a data rate of 5 Mbps and comes in a square chip carrier package, suitable for telecom circuit applications. With a terminal pitch of 0.5mm and no lead terminal form, it offers high performance in compact designs.
5 Mbps
S-PQCC-N24
4 mm
24
0 Cel
LCC24,.16SQ,20
1 mm
Other Telecom ICs
.12 mA
RI-TRP-R4FF-01
TELECOM CIRCUIT; Temperature Grade: OTHER; No. of Functions: 1; Minimum Operating Temperature: -25 Cel; Maximum Operating Temperature: 50 Cel; Qualification: Not Qualified;
RI-TRP-W4FF-01
TELECOM CIRCUIT; Temperature Grade: OTHER; Maximum Operating Temperature: 50 Cel; Qualification: Not Qualified; Minimum Operating Temperature: -25 Cel; No. of Functions: 1;
HTSFCH4801EV/DH,11
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Qualification: Not Qualified;
X-XUUC-N
DIE
UNCASED CHIP
UPPER
HTSMOH3201EV,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -25 Cel;
HTSMOH5601EV,118
SILVER
PN5110A0HN1/C2,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
PN5110A0HN1/C2,151
PN5120A0HN1/C1,151
PN5120A0HN1/C1,151 by NXP Semiconductors is a telecom interface IC with 32 terminals and power supplies of 1.8/3.3V, suitable for telecom circuits. It operates b/w -30 to 85°C, has a terminal pitch of 0.5mm, and features a nickel palladium gold finish for robust connectivity in various applications.
LCC32,.2SQ,20
1.8/3.3,2.5/3.3
RF-HDT-DVBB-N1
TELECOM CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Qualification: Not Qualified; No. of Functions: 1; Maximum Operating Temperature: 90 Cel;
90 Cel
RF-HDT-DVBE-N0
TELECOM CIRCUIT; Temperature Grade: OTHER; Qualification: Not Qualified; Minimum Operating Temperature: -25 Cel; Maximum Operating Temperature: 90 Cel; No. of Functions: 1;
RI-TRP-DR2B-30
TELECOM CIRCUIT; Temperature Grade: OTHER; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Functions: 1; Qualification: Not Qualified; Minimum Operating Temperature: -25 Cel;
NOT SPECIFIED
RI-TRP-DR2B
TELECOM CIRCUIT; Temperature Grade: OTHER; No. of Functions: 1; Minimum Operating Temperature: -25 Cel; Maximum Operating Temperature: 85 Cel; Moisture Sensitivity Level (MSL): 1;
RI-TRP-R9QL-30
TELECOM CIRCUIT; Temperature Grade: OTHER; No. of Functions: 1; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Operating Temperature: 85 Cel; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
RI-TRP-W9QL-20
TELECOM CIRCUIT; Temperature Grade: OTHER; Moisture Sensitivity Level (MSL): 1; Minimum Operating Temperature: -25 Cel; No. of Functions: 1; Qualification: Not Qualified;
RI-TRP-W9QL-30
TELECOM CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Peak Reflow Temperature (C): NOT SPECIFIED; Qualification: Not Qualified; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
RI-TRP-WE2B-30
TELECOM CIRCUIT; Temperature Grade: OTHER; JESD-609 Code: e1; No. of Functions: 1; Maximum Operating Temperature: 70 Cel; Terminal Finish: TIN SILVER COPPER;
RI-TRP-WEHP-30
TELECOM CIRCUIT; Temperature Grade: OTHER; Maximum Operating Temperature: 70 Cel; Qualification: Not Qualified; JESD-609 Code: e1; No. of Functions: 1;
RI-TRP-WR2B-30
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Finish: TIN SILVER COPPER; Maximum Operating Temperature: 85 Cel; JESD-609 Code: e1; Qualification: Not Qualified;
PCM3060PWRG4
PCM3060PWRG4 by Texas Instruments is a Telecom Interface IC with 2 channels, CMOS technology, and 3.3V supply voltage. It comes in a small outline package with 28 terminals and operates b/w -25°C to 85°C. Ideal for telecom circuits due to its compact size and high-temperature range suitability.
Nickel/Palladium/Gold (Ni/Pd/Au)
RI-TRP-R9TD-16
TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; No. of Functions: 1; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -25 Cel;
RI-TRP-W9TD-13
TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Package Body Material: UNSPECIFIED; No. of Functions: 1; Minimum Operating Temperature: -25 Cel;
RI-I03-114A-01
TELECOM CIRCUIT; Temperature Grade: OTHER; Peak Reflow Temperature (C): NOT SPECIFIED; Minimum Operating Temperature: -25 Cel; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Functions: 1;
RI-I03-114A-S1
TELECOM CIRCUIT; Temperature Grade: OTHER; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED; Qualification: Not Qualified; Minimum Operating Temperature: -25 Cel;
RI-I11-112A-03
TELECOM CIRCUIT; Temperature Grade: OTHER; Minimum Operating Temperature: -25 Cel; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Operating Temperature: 70 Cel; No. of Functions: 1;
RI-I11-112B-03
TELECOM CIRCUIT; Temperature Grade: OTHER; No. of Functions: 1; Maximum Operating Temperature: 70 Cel; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
RI-I16-114A-S1
TELECOM CIRCUIT; Temperature Grade: OTHER; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Maximum Operating Temperature: 70 Cel; No. of Functions: 1; Minimum Operating Temperature: -25 Cel;
RI-I17-114A-S1
TELECOM CIRCUIT; Temperature Grade: OTHER; Peak Reflow Temperature (C): NOT SPECIFIED; Minimum Operating Temperature: -25 Cel; Maximum Operating Temperature: 70 Cel; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
RI-TRP-R4FF-30
TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Package Body Material: UNSPECIFIED; Minimum Operating Temperature: -25 Cel;
RI-TRP-W4FF-30
TELECOM CIRCUIT; Temperature Grade: OTHER; Package Shape: UNSPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED; Package Body Material: UNSPECIFIED; Minimum Operating Temperature: -25 Cel;
HTRM800/AED,122
TELECOM CIRCUIT; Temperature Grade: OTHER; Maximum Operating Temperature: 70 Cel; Qualification: Not Qualified; Package Body Material: PLASTIC/EPOXY; Nominal Negative Supply Voltage: -15 V;
-15 V
MODULE(UNSPEC)
+-15
.55 mA
15 V
PN5120A0HN1/C1,157
PN5120A0HN1/C1,157 by NXP Semiconductors is a telecom interface IC with 32 terminals in a square package. Operating at -30 to 85°C, it supports power supplies of 1.8/3.3V and 2.5/3.3V. Ideal for telecom circuits, this chip carrier has a very thin profile and nickel palladium gold finish for robust performance in various applications.
MP45DT02TR-M
STMicroelectronics MP45DT02TR-M is a telecom IC with 6 terminals, operating b/w -30 to 85°C. It has a rectangular shape, grid array package style, and nickel palladium gold finish. With a nominal voltage of 1.8V, it's ideal for telecom circuit applications due to its compact size (4.72mm x 3.76mm) and no-lead terminal form.
R-XBGA-N6
4.72 mm
LGA
GRID ARRAY
1.35 mm
1.8 V
3.76 mm
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