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L3845D1013TR

STMicroelectronics

L3845D1013TR by STMicroelectronics

STMicroelectronics L3845D1013TR is a telecom interface IC with 8 terminals in a small outline package. It operates b/w -40 °C to 70°C, suitable for telecom circuits. The package is made of plastic/epoxy, surface mountable, and has a gull wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,125 parts In-Stock

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8,125

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Digiode

USA . 4,807 parts In-Stock

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4,807

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Anansix

USA . 1,530 parts In-Stock

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Sea View Technologies

USA . 46 parts In-Stock

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Bristol Electronics

USA . 46 parts In-Stock

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46

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Distributors (Availability)

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Microchip USA

USA . 311 parts In-Stock

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$2.823

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311

$2.823

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AZTECH Wire

Italy . 605 parts In-Stock

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$8.720

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605

$8.720

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IDEA Electronic Components Group

UK . 1,233 parts In-Stock

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$12.316

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$11.084

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$12.316

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$11.084

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MKK Technologies

India . 167 parts In-Stock

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$23.160

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$23.160

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DigiPath Technology Company

USA . 167 parts In-Stock

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$23.160

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$23.160

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QUARKTWIN TECHNOLOGY LTD

USA . 14,994 parts In-Stock

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Vigor

Singapore . 1,161 parts In-Stock

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Corphita

USA . 734 parts In-Stock

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Assy Fe

Spain . 731 parts In-Stock

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Parana Technologies

USA . 653 parts In-Stock

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$14.726

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$14.726

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GreenTree Electronics

Israel . 60 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 60 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 60 parts In-Stock

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Overview

Experience seamless connectivity with the L3845D1013TR by STMicroelectronics, a top-tier manufacturer known for its superior quality and cutting-edge technology. Ideal for various telecom applications, this telecom interface IC offers unmatched reliability and performance. With a compact design and high temperature tolerance, this product ensures long-lasting functionality. Upgrade your system with the L3845D1013TR and enjoy unparalleled value and benefits that will take your project to the next level. Elevate your communication experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, ensuring a long-lasting performance.

Surface Mount: YES

Ease of installation and compatibility with modern PCB designs.

Package Shape: RECTANGULAR

Compact and space-efficient design for efficient PCB layout.

No. of Terminals: 8

Sufficient number of terminals for connecting to various components in a telecom system.

Package Style (Meter): SMALL OUTLINE

Space-saving design suitable for compact electronic devices.

Maximum Operating Temperature: 70 °C

Ability to operate under high temperature conditions without compromising performance.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, ensuring reliable operation in various environments.

Terminal Finish: TIN LEAD

Provides good electrical conductivity and protects terminals from corrosion.

Terminal Position: DUAL

Allows for flexible connection options and compatibility with different circuit configurations.

Maximum Seated Height: 1.75 mm

Low profile design for space-constrained applications.

Width: 3.9 mm

Compact size for efficient use of PCB real estate.

Length: 4.9 mm

Optimal size for accommodating all necessary components within the package.

Terminal Form: GULL WING

Ease of soldering and reliable connection for improved performance.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimal performance in such systems.

Terminal Pitch: 1.27 mm

Standard pitch for easy integration with other components on the PCB.

Technical Specifications

Other Function Telecom Interface ICs L3845D1013TR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

L3845D1013TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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