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L3845D

STMicroelectronics

L3845D by STMicroelectronics

L3845D by STMicroelectronics is a telecom interface IC designed for robust performance in various applications. It operates at a nominal voltage of 20V, with a temperature range from -40 °C to 70°C. This compact, surface-mount device features an 8-terminal gull-wing design for efficient integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,803 parts In-Stock

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4,803

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Digiode

USA . 2,230 parts In-Stock

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2,230

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Anansix

USA . 1,461 parts In-Stock

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1,461

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Pegasus Components GmbH

Germany . 99 parts In-Stock

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Inland Empire Components Inc.

USA . 50 parts In-Stock

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50

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IDEA Electronic Components Group

UK . 1,406 parts In-Stock

1+ parts

$11.480

100+ parts

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$10.332

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1,406

$11.480

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$10.332

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MKK Technologies

India . 1,548 parts In-Stock

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$21.587

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$21.587

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DigiPath Technology Company

USA . 1,548 parts In-Stock

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$21.587

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1,548

$21.587

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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A-Z Elektronik GmbH

Germany . 6,573 parts In-Stock

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Benley Electronics

USA . 6,004 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,382 parts In-Stock

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Parana Technologies

USA . 1,840 parts In-Stock

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$13.726

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$13.726

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Corphita

USA . 778 parts In-Stock

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Kepictronics

USA . 95 parts In-Stock

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GreenTree Electronics

Israel . 69 parts In-Stock

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Overview

Unlock seamless communication with the L3845D from STMicroelectronics, a leader in innovative electronic solutions. Designed for reliability and performance, this compact telecom interface IC ensures robust connectivity across various applications. With exceptional temperature resilience and premium materials, it guarantees long-lasting quality. Elevate your projects with a trusted component that enhances efficiency, reduces downtime, and delivers unmatched value—empowering you to stay ahead in today’s fast-paced tech landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, enhancing the longevity of the product.

Surface Mount: YES

Surface mount technology allows for a more compact design and easy integration into modern devices, making it ideal for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes the layout and density of electronic components on a PCB, improving overall performance.

Power Supplies (V): 20

Operating at a supply voltage of 20V allows for compatibility with a wide range of telecom systems, making it a versatile choice for different applications.

No. of Terminals: 8

With 8 terminals, the IC provides sufficient connectivity options for various functionalities, ensuring good performance in telecom applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces necessary board space while maintaining performance, which is particularly beneficial in compact devices.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable operation in warmer environments, expanding the range of applications.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C allows this IC to function reliably in harsh environments, making it suitable for outdoor applications and extreme conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish improves connectivity and reduces oxidation, ensuring sustained performance over time.

Terminal Position: DUAL

Dual terminal positioning facilitating ease of placement and soldering, minimizing assembly time and enhancing reliability in performance.

Maximum Seated Height: 1.75 mm

With a low seated height of 1.75 mm, this IC is well-suited for applications where height restriction is critical.

Width: 3.9 mm

A compact width of 3.9 mm allows the IC to be integrated easily into tight spaces within electronic devices.

Length: 4.9 mm

The length of 4.9 mm complements the small package size, making it an excellent fit for modern, size-sensitive telecom devices.

Terminal Form: GULL WING

The gull wing terminal form provides improved solder joint reliability and ease of inspection, which is crucial during manufacturing.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit, this IC is specifically designed for telecommunications, ensuring optimal performance in data and voice transmission tasks.

Nominal Supply Voltage: 20 V

A nominal supply voltage of 20 V supports various telecom applications, ensuring the IC operates efficiently across many systems.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for compact layouts while ensuring adequate space for soldering, improving overall manufacturability.

Technical Specifications

Other Function Telecom Interface ICs L3845D attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

20

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Transmission Interfaces

Nominal Supply Voltage:

20 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

L3845D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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