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LM3290TME/NOPB

Texas Instruments

LM3290TME/NOPB by Texas Instruments

LM3290TME/NOPB by Texas Instruments is a 30-terminal GRID ARRAY IC with TIN SILVER COPPER finish. It operates b/w -30 to 85 °C, with peak reflow temp of 260C for telecom circuits. Its 0.4mm pitch and 0.675mm height make it suitable for compact telecom interface applications.

Median Price

$3.930

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 399 parts In-Stock

1+ parts

$3.930

100+ parts

$2.465

1k+ parts

$2.225

10k+ parts

$2.135

399

$3.930

$2.465

$2.225

$2.135

Mouser Electronics

USA . 215 parts In-Stock

1+ parts

$3.930

100+ parts

$2.470

1k+ parts

$2.150

10k+ parts

$2.120

215

$3.930

$2.470

$2.150

$2.120

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.978

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.978

-

-

-

Digiode

USA . 2,354 parts In-Stock

1+ parts

$3.144

100+ parts

-

1k+ parts

-

10k+ parts

-

2,354

$3.144

-

-

-

Vyrian

USA . 4,668 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,668

-

-

-

-

Bristol Electronics

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$1.427

1k+ parts

$1.253

10k+ parts

-

500

-

$1.427

$1.253

-

Dan-Mar Components

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,536 parts In-Stock

1+ parts

$1.978

100+ parts

-

1k+ parts

-

10k+ parts

$1.938

2,536

$1.978

-

-

$1.938

Argo Parts USA

USA . 1,566 parts In-Stock

1+ parts

$1.978

100+ parts

-

1k+ parts

-

10k+ parts

-

1,566

$1.978

-

-

-

Ampacity Inc.

Singapore . 304 parts In-Stock

1+ parts

$2.810

100+ parts

-

1k+ parts

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10k+ parts

-

304

$2.810

-

-

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Corphita

USA . 4,906 parts In-Stock

1+ parts

$2.979

100+ parts

-

1k+ parts

-

10k+ parts

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4,906

$2.979

-

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AZTECH Wire

Italy . 884 parts In-Stock

1+ parts

$10.479

100+ parts

-

1k+ parts

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10k+ parts

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884

$10.479

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Parana Technologies

USA . 1,385 parts In-Stock

1+ parts

$10.578

100+ parts

-

1k+ parts

$11.079

10k+ parts

-

1,385

$10.578

-

$11.079

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Corohmni

South Africa . 529 parts In-Stock

1+ parts

$11.384

100+ parts

-

1k+ parts

-

10k+ parts

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529

$11.384

-

-

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ChromeModa Solutions

Germany . 6,073 parts In-Stock

1+ parts

$11.885

100+ parts

$9.746

1k+ parts

-

10k+ parts

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6,073

$11.885

$9.746

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IDEA Electronic Components Group

UK . 1,895 parts In-Stock

1+ parts

$11.885

100+ parts

$11.291

1k+ parts

$10.696

10k+ parts

-

1,895

$11.885

$11.291

$10.696

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,000

-

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DigiPath Technology Company

USA . 856 parts In-Stock

1+ parts

-

100+ parts

$10.716

1k+ parts

-

10k+ parts

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856

-

$10.716

-

-

Overview

Upgrade your telecom interface systems with the LM3290TME/NOPB by Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers a wide range of innovative solutions in the Other Function Telecom Interface ICs category. This product, featuring a surface mount design and a 30-terminal grid array package style, ensures seamless integration and optimal performance. With a maximum operating temperature of 85°C and a terminal finish of tin silver copper, the LM3290TME/NOPB delivers unmatched durability and functionality. Experience the value and benefits of this cutting-edge technology for your telecom applications today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly, making this product a convenient choice for manufacturers.

Package Shape: RECTANGULAR

Rectangular shape provides a compact design, saving space in electronic devices and improving overall efficiency.

No. of Terminals: 30

With a high number of terminals, this product offers versatility in connectivity options and potential for complex circuit designs.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability even in demanding operating conditions.

Minimum Operating Temperature: -30 °C

Low minimum operating temperature allows for operation in a wide range of environments, increasing the product's usability.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides excellent conductivity and corrosion resistance, enhancing the reliability and longevity of the product.

Terminal Position: BOTTOM

Bottom terminal position offers convenience in circuit board layout and assembly, making this product easy to integrate into electronic devices.

Maximum Seated Height: 0.675 mm

Low maximum seated height helps in achieving a slim profile for the product, enabling its use in compact electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature minimizes the risk of thermal damage during assembly processes, ensuring product integrity.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for robust soldering connections, enhancing the product's durability and resilience.

Terminal Form: BALL

Ball terminal form enables secure and reliable connections, contributing to the overall performance and longevity of the product.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this product offers optimized functionality and performance in telecommunications applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high density of connections, enabling complex circuit designs and efficient use of board space.

Technical Specifications

Other Function Telecom Interface ICs LM3290TME/NOPB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B30

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM3290TME/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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