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LM3291TMX/NOPB

Texas Instruments

LM3291TMX/NOPB by Texas Instruments

LM3291TMX/NOPB by Texas Instruments is a telecom interface IC with 12 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30s. This very thin profile IC is ideal for telecom circuit applications due to its fine pitch and ball terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,504 parts In-Stock

1+ parts

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7,504

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Digiode

USA . 2,619 parts In-Stock

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2,619

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 351 parts In-Stock

1+ parts

$12.590

100+ parts

-

1k+ parts

$13.044

10k+ parts

-

351

$12.590

-

$13.044

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DigiPath Technology Company

USA . 1,880 parts In-Stock

1+ parts

$13.863

100+ parts

$12.754

1k+ parts

-

10k+ parts

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1,880

$13.863

$12.754

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ChromeModa Solutions

Germany . 4,484 parts In-Stock

1+ parts

$14.146

100+ parts

$11.600

1k+ parts

-

10k+ parts

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4,484

$14.146

$11.600

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IDEA Electronic Components Group

UK . 415 parts In-Stock

1+ parts

$14.146

100+ parts

$13.439

1k+ parts

$12.731

10k+ parts

-

415

$14.146

$13.439

$12.731

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AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$18.550

100+ parts

-

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192

$18.550

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One Stop Electronics

USA . 168 parts In-Stock

1+ parts

$327.000

100+ parts

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168

$327.000

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Corphita

USA . 3,301 parts In-Stock

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3,301

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Overview

Unlock the power of seamless communication with the LM3291TMX/NOPB by Texas Instruments. Crafted with precision and reliability in mind, this cutting-edge telecom interface IC offers unparalleled performance in a compact, surface-mount package. Perfect for a wide range of applications, from telecommunications to networking, this versatile component ensures optimal connectivity and functionality. Trust Texas Instruments to deliver quality and innovation, providing you with the tools you need to stay ahead of the curve. Elevate your projects with the LM3291TMX/NOPB and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto printed circuit boards, saving time and cost in manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor that can easily fit into existing designs and layouts, ensuring compatibility and ease of integration.

No. of Terminals: 12

Having 12 terminals allows for connection to multiple external components or circuits, increasing the versatility and functionality of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding environmental conditions and ensure reliable performance in various applications.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature range enables this product to function effectively in cold environments without risk of damage or malfunction.

Terminal Finish: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finish ensures good conductivity, corrosion resistance, and solderability, enhancing the overall reliability and longevity of the product.

Terminal Position: BOTTOM

Bottom terminal position allows for efficient heat dissipation and better thermal management, leading to improved overall performance and longevity of the product.

Maximum Seated Height: 0.675 mm

The very thin profile of this product makes it suitable for compact designs and applications where space is limited, without compromising on functionality or performance.

Maximum Time At Peak Reflow Temperature (s): 30

The short time required at peak reflow temperature during manufacturing processes helps prevent thermal stress and ensures reliable solder joints, improving the overall quality and durability of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for efficient and effective soldering processes, resulting in strong and reliable electrical connections for optimal performance.

Terminal Form: BALL

Ball terminal form provides a reliable and robust connection with high electrical conductivity, ensuring stable and consistent signal transmission for improved overall performance.

Terminal Pitch: 0.4 mm

The fine pitch of 0.4mm enables high-density mounting and precise alignment of components, allowing for compact designs and efficient use of space in electronic devices.

Technical Specifications

Other Function Telecom Interface ICs LM3291TMX/NOPB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B12

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.675 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LM3291TMX/NOPB Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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