Loading...

STHVDAC-256MTGF3

STMicroelectronics

STHVDAC-256MTGF3 by STMicroelectronics

STHVDAC-256MTGF3 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates b/w -30 °C to 85 °C, with a nominal voltage of 3.3V and features a very thin profile in a 20-terminal grid array package. Ideal for compact telecom systems, it ensures efficient signal processing.

Median Price

$0.054

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,856 parts In-Stock

1+ parts

$0.055

100+ parts

$0.052

1k+ parts

$0.049

10k+ parts

$0.049

1,856

$0.055

$0.052

$0.049

$0.049

Verical

USA . 1,856 parts In-Stock

1+ parts

-

100+ parts

$0.052

1k+ parts

$0.049

10k+ parts

$0.049

1,856

-

$0.052

$0.049

$0.049

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,162 parts In-Stock

1+ parts

$0.052

100+ parts

-

1k+ parts

-

10k+ parts

-

2,162

$0.052

-

-

-

Vyrian

USA . 4,404 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,404

-

-

-

-

Anansix

USA . 2,521 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,521

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,389 parts In-Stock

1+ parts

$0.044

100+ parts

-

1k+ parts

-

10k+ parts

-

1,389

$0.044

-

-

-

Corphita

USA . 2,348 parts In-Stock

1+ parts

$0.050

100+ parts

-

1k+ parts

-

10k+ parts

-

2,348

$0.050

-

-

-

Microchip USA

USA . 461 parts In-Stock

1+ parts

$3.044

100+ parts

-

1k+ parts

-

10k+ parts

-

461

$3.044

-

-

-

IDEA Electronic Components Group

UK . 254 parts In-Stock

1+ parts

$8.765

100+ parts

-

1k+ parts

$7.888

10k+ parts

-

254

$8.765

-

$7.888

-

AZTECH Wire

Italy . 962 parts In-Stock

1+ parts

$11.510

100+ parts

-

1k+ parts

-

10k+ parts

-

962

$11.510

-

-

-

MKK Technologies

India . 1,669 parts In-Stock

1+ parts

$16.482

100+ parts

-

1k+ parts

-

10k+ parts

-

1,669

$16.482

-

-

-

DigiPath Technology Company

USA . 1,669 parts In-Stock

1+ parts

$16.482

100+ parts

-

1k+ parts

-

10k+ parts

-

1,669

$16.482

-

-

-

Vigor

Singapore . 3,957 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,957

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Parana Technologies

USA . 391 parts In-Stock

1+ parts

-

100+ parts

$10.480

1k+ parts

-

10k+ parts

-

391

-

$10.480

-

-

Overview

Unlock the potential of your telecom applications with the STHVDAC-256MTGF3 from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers superior quality and reliability in every product. This advanced telecom interface IC supports a wide range of innovative uses, ensuring seamless communication and enhanced performance. Elevate your designs with this compact, efficient solution, and experience the unmatched value and benefits that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and resistance to environmental factors, ensuring reliability in various conditions.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient assembly processes, making it ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on circuit boards, facilitating versatile design layouts.

No. of Terminals: 20

With 20 terminals, this component offers sufficient connectivity for complex circuits while maintaining a compact footprint.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a very thin profile enables higher density packaging, which is critical for space-constrained applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures performance stability in higher temperature environments, enhancing reliability.

Minimum Operating Temperature: -30 °C

Operating in a temperature range starting from -30 °C allows this product to function effectively in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal positioning can facilitate improved thermal performance and streamlined PCB layout.

Maximum Seated Height: 0.64 mm

A maximum seated height of 0.64 mm contributes to a low-profile design, making it suitable for slim products.

Width: 1.94 mm

A width of 1.94 mm provides a compact footprint, optimizing space on the PCB for additional components.

Length: 2.23 mm

A length of 2.23 mm allows for an efficient arrangement of multiple components on the circuit board.

Terminal Form: BALL

Ball terminal form enhances solderability and assures a reliable electrical connection, crucial for telecom applications.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed as a telecom circuit IC, this product is optimized for communication applications, ensuring performance in signal processing tasks.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is standard in many digital circuits, allowing for easy integration with existing systems.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm facilitates a fine pitch connection, promoting high-density interconnection in compact devices.

Technical Specifications

Other Function Telecom Interface ICs STHVDAC-256MTGF3 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B20

Length:

2.23 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.64 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.94 mm

Trade Compliance

STHVDAC-256MTGF3 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 3