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STHVDAC-253C7

STMicroelectronics

STHVDAC-253C7 by STMicroelectronics

STHVDAC-253C7 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates b/w -30 °C and 85 °C, with a nominal voltage of 3.3V and features a very thin profile grid array package. Ideal for compact telecom systems, it ensures efficient performance in limited spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,052 parts In-Stock

1+ parts

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7,052

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Digiode

USA . 2,134 parts In-Stock

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2,134

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Anansix

USA . 580 parts In-Stock

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580

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 621 parts In-Stock

1+ parts

$0.960

100+ parts

-

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621

$0.960

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Microchip USA

USA . 354 parts In-Stock

1+ parts

$3.289

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354

$3.289

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IDEA Electronic Components Group

UK . 1,239 parts In-Stock

1+ parts

$8.401

100+ parts

-

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$7.561

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1,239

$8.401

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$7.561

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AZTECH Wire

Italy . 908 parts In-Stock

1+ parts

$13.100

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908

$13.100

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MKK Technologies

India . 2,143 parts In-Stock

1+ parts

$15.798

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2,143

$15.798

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DigiPath Technology Company

USA . 2,143 parts In-Stock

1+ parts

$15.798

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2,143

$15.798

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ChipstoGo Electronic ltd

UK . 10,000 parts In-Stock

1+ parts

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10,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Corphita

USA . 2,704 parts In-Stock

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2,704

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QUARKTWIN TECHNOLOGY LTD

USA . 2,185 parts In-Stock

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2,185

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Parana Technologies

USA . 295 parts In-Stock

1+ parts

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$10.045

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295

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$10.045

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Overview

Unlock the potential of your telecom applications with the STHVDAC-253C7 from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a versatile interface IC that excels in performance while ensuring reliability across temperature ranges. Its compact design and easy integration make it ideal for modern communication solutions, empowering you to enhance system efficiency and achieve remarkable results. Elevate your projects with this exceptional component!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact board layout and improved performance in high-density applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on a circuit board, making it suitable for space-constrained designs.

No. of Terminals: 12

With 12 terminals, this IC provides ample connectivity options, facilitating versatile circuit designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The very thin profile and fine pitch design enhances thermal performance and supports high-frequency applications.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C ensures reliability in challenging environments.

Minimum Operating Temperature: -30 °C

A minimum operating temperature of -30 °C allows the IC to function effectively in extreme cold conditions, expanding its application range.

Terminal Position: BOTTOM

Bottom-terminal positioning improves solder joint reliability and contributes to efficient heat dissipation.

Maximum Seated Height: 0.64 mm

The low seated height allows for thinner designs, contributing to overall device miniaturization.

Width: 1.1 mm

With a narrow width, it is ideal for applications where space is a premium, accommodating compact layouts.

Length: 1.45 mm

The short length aids in fitting within tight spaces, maintaining the design integrity of the PCB.

Terminal Form: BALL

Ball terminals provide robust mechanical and electrical connections, promoting reliability during operation.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring optimal performance and compliance with industry standards.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is standard for many digital circuits, making the IC broadly compatible with other components.

Terminal Pitch: 0.35 mm

A fine terminal pitch of 0.35 mm supports high-density layouts, enabling the integration of more functionalities in a smaller area.

Technical Specifications

Other Function Telecom Interface ICs STHVDAC-253C7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-XBGA-B12

Length:

1.45 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA12,3X4,14

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.64 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.1 mm

Trade Compliance

STHVDAC-253C7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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